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Proceedings Papers

Evaluation of Simulated Railhead Weld-Defect Repairs Using Ultrasound Techniques

Demario Broderick, Munshi Basit, Heshmat Aglan
Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A041, October 30–November 3, 2022
Paper No: IMECE2022-95140
DOI: https://doi.org/10.1115/IMECE2022-95140
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Topics: Maintenance, Ultrasound, Rails, Probes, Calibration, Welding, Ceramic fibers, Fillers (Materials), Flow (Dynamics), Hardening
Proceedings Papers

The Effects of Temperature, Strain Rate, and Aging on the Poisson’s Ratio of SAC Lead Free Solders

K. M. Rafidh Hassan, Mohammad S. Alam, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, August 27–30, 2018
Paper No: IPACK2018-8410
DOI: https://doi.org/10.1115/IPACK2018-8410
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Topics: Lead-free solders, Poisson ratio, Temperature effects, Solders, Temperature, Cooling, Finite element analysis, Finite element methods, Finite element model, Reliability
Proceedings Papers

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A039, July 6–9, 2015
Paper No: IPACK2015-48620
DOI: https://doi.org/10.1115/IPACK2015-48620
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Topics: Finite element analysis, Reliability, Failure, Lead-free solders, Temperature, Accelerated life testing, Ball-Grid-Array packaging, Fracture (Materials), Lumber, Modeling
Proceedings Papers

Viscoplastic Constitutive Model for Lead-Free Solder Including Effects of Silver Content, Solidification Profile, and Severe Aging

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A002, July 6–9, 2015
Paper No: IPACK2015-48619
DOI: https://doi.org/10.1115/IPACK2015-48619
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Topics: Constitutive equations, Lead-free solders, Silver, Solidification, Alloys, Mechanical properties, Water, Solders, Reliability, Stress-strain curves
Proceedings Papers

Characterization of Doped SAC Solder Materials and Determination of Anand Parameters

Sudan Ahmed, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A003, July 6–9, 2015
Paper No: IPACK2015-48624
DOI: https://doi.org/10.1115/IPACK2015-48624
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Topics: Solders, Alloys, Reliability, Silver, Stress-strain curves, Temperature, Tin, Constitutive equations, Copper, Economics
Proceedings Papers

A Revised Anand Constitutive Model for Lead Free Solder That Includes Aging Effects

Mohammad Motalab, Munshi Basit, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A009, July 16–18, 2013
Paper No: IPACK2013-73232
DOI: https://doi.org/10.1115/IPACK2013-73232
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Topics: Constitutive equations, Lead-free solders