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Mudasir Ahmad
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Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 461-466, July 6–11, 2003
Paper No: IPACK2003-35231
Journal Articles
Journal Articles
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 411–418.
Published Online: December 12, 2002
Topics: Springs, Stress