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Proceedings Papers

A Hepatic Sinusoids-Based Microreactor for Photocatalytic Degradation of Methylene Blue by Titanium Dioxide

Mahmoud A. Shouman, Ahmed H. El-Shazly, Mohamed S. Salem, Mohamed R. Elmarghany, Essam M. Abo-Zahhad, Marwa F. Elkady, Mohamed Nabil Sabry, Ali Radwan

Proc. ASME. ICNMM2020, ASME 2020 18th International Conference on Nanochannels, Microchannels, and Minichannels, V001T02A001, July 13–15, 2020

Paper No: ICNMM2020-1004

DOI: https://doi.org/10.1115/ICNMM2020-1004

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Topics: Liver, Titanium dioxide, Flow (Dynamics), Biomedicine, Chemical industry, Food products, Fuels, Water, Wavelength

Journal Articles

Generalization of the Heat Transfer Coefficient Concept for System Simulation

Mohamed-Nabil Sabry

J. Heat Transfer. June 2011, 133(6): 060905.

DOI: https://doi.org/10.1115/1.4003452

Published Online: March 7, 2011

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Topics: Boundary-value problems, Convection, Fluids, Heat, Heat flux, Heat transfer, Heat transfer coefficients, Simulation, Temperature, Heat conduction

Journal Articles

Thermal Issues in Emerging Technologies

Yogendra Joshi, Mohamed-Nabil Sabry

J. Heat Transfer. June 2011, 133(6): 060301.

DOI: https://doi.org/10.1115/1.4003447

Published Online: March 7, 2011

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Topics: Convection, Cooling, Foams (Chemistry), Heat sinks, Microfabrication, Micromechanical devices, Two-phase flow, Heat transfer

Proceedings Papers

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Mohamed-Nabil Sabry

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 187-191, July 19–23, 2009

Paper No: InterPACK2009-89415

DOI: https://doi.org/10.1115/InterPACK2009-89415

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Topics: Heat transfer, Thermal stresses, Fluids, Design, Heat, Temperature, Temperature profiles, Wall temperature, Boundary-value problems, Degrees of freedom

Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry

J. Electron. Packag. September 2010, 132(3): 030201.

DOI: https://doi.org/10.1115/1.3493694

Published Online: September 30, 2010

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Topics: Electronic packaging, Cooling, Reliability

Proceedings Papers

High Precision Compact Thermal Models

Mohamed-Nabil Sabry

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1379-1387, July 17–22, 2005

Paper No: IPACK2005-73051

DOI: https://doi.org/10.1115/IPACK2005-73051

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Topics: Errors, Heat, Reliability, Temperature gradient

Proceedings Papers

Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress

Mohamed-Nabil Sabry

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 399-415, July 6–11, 2003

Paper No: IPACK2003-35185

DOI: https://doi.org/10.1115/IPACK2003-35185

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Topics: Design, Electronic systems, Nanoscale phenomena, Reliability, Temperature effects

Proceedings Papers

The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models

Clemens J. M. Lasance, Mohamed-Nabil Sabry

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003

Paper No: IPACK2003-35167

DOI: https://doi.org/10.1115/IPACK2003-35167

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Topics: Ball-Grid-Array packaging, Design, Electronic circuits, Modeling, Reliability, Steady state, Temperature, Temperature effects, Thermal analysis, Transients (Dynamics)

Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry

J. Electron. Packag. December 2008, 130(4): 040201.

DOI: https://doi.org/10.1115/1.3039759

Published Online: November 17, 2008

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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells

Journal Articles

Compact Thermal Models: A Global Approach

Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid

J. Electron. Packag. December 2008, 130(4): 041107.

DOI: https://doi.org/10.1115/1.2993132

Published Online: November 14, 2008

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Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer

Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry

J. Electron. Packag. September 2007, 129(3): 256–259.

DOI: https://doi.org/10.1115/1.2753908

Published Online: April 16, 2007

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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability

Journal Articles

Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

Mohamed-Nabil Sabry

J. Electron. Packag. December 2001, 123(4): 344–350.

DOI: https://doi.org/10.1115/1.1390342

Published Online: March 21, 2001

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Topics: Design, Fluids, Heat transfer, Microchannels, Temperature, Temperature gradient, Flow (Dynamics), Heat, Cooling

Journal citation

NARROW

A Hepatic Sinusoids-Based Microreactor for Photocatalytic Degradation of Methylene Blue by Titanium Dioxide

Generalization of the Heat Transfer Coefficient Concept for System Simulation

Thermal Issues in Emerging Technologies

Predicting Thermal Stresses Induced by Conjugate Heat Transfer

Editorial

High Precision Compact Thermal Models

Dynamic Compact Thermal Models Used for Electronic Design: A Review of Recent Progress

The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models

Editorial

Compact Thermal Models: A Global Approach

Flexible Profile Compact Thermal Models for Practical Geometries

Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design

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