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Melody A. Verges
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Proceedings Papers

Young’s Modulus and Hardness of Zr 0.5 Hf 0.5 Co x Rh 1−x Sb 0.99 Sn 0.01 and Zr 0.5 Hf 0.5 Co x Ir 1−x Sb 0.99 Sn 0.01 Half-Heusler Alloys

Melody A. Verges, Paul J. Schilling, Jeffrey D. Germond, Puja Upadyhay, William K. Miller, Pramathesh Maji, Nathan J. Takas, Pierre F. P. Poudeu
Proc. ASME. IMECE2010, Volume 5: Energy Systems Analysis, Thermodynamics and Sustainability; NanoEngineering for Energy; Engineering to Address Climate Change, Parts A and B, 1427-1433, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-38988
https://doi.org/10.1115/IMECE2010-38988
View Paper titled, Young’s Modulus and Hardness of Zr 0.5 Hf 0.5 Co x Rh 1−x Sb 0.99 Sn 0.01 and Zr 0.5 Hf 0.5 Co x Ir 1−x Sb 0.99 Sn 0.01 Half-Heusler Alloys
Open the PDF for Young’s Modulus and Hardness of Zr 0.5 Hf 0.5 Co x Rh 1−x Sb 0.99 Sn 0.01 and Zr 0.5 Hf 0.5 Co x Ir 1−x Sb 0.99 Sn 0.01 Half-Heusler Alloys in another window
Topics: Alloys, Tin, Young's modulus, Zirconium, Cobalt, Elastic moduli, Mechanical testing, Microhardness, Nanoindentation, Stiffness
Proceedings Papers

Identification of Critical Surface Displacement Parameters for Characterization of Subsurface Flaws

Paul D. Herrington, Paul J. Schilling, Melody A. Verges, Prashanth K. Durgam
Proc. ASME. IMECE2002, Recent Advances in Solids and Structures, 23-27, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32290
https://doi.org/10.1115/IMECE2002-32290
View Paper titled, Identification of Critical Surface Displacement Parameters for Characterization of Subsurface Flaws
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Topics: Displacement, Geometry, Finite element model, Nondestructive evaluation
Proceedings Papers

Investigation of Microcrack Growth in [0/90] s Composite Laminates

Melody A. Verges, Paul J. Schilling, Paul D. Herrington, Arun K. Tatiparthi
Proc. ASME. IMECE2003, Recent Advances in Mechanics of Solids and Structures, 171-175, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43720
https://doi.org/10.1115/IMECE2003-43720
View Paper titled, Investigation of Microcrack Growth in [0/90] s Composite Laminates
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Topics: Composite materials, Laminates, Microcracks, Damage, Density, Dimensions, Geometry, Optical microscopy, Stress, X-rays
Journal Articles

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 18–23.
https://doi.org/10.1115/1.1520430
Published Online: March 14, 2003
View Article titled, Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
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Topics: Compression, Die cutting, Fatigue cracks, Fatigue life, Fracture (Materials), Printed circuit boards, Shear (Mechanics), Shearing (Deformation), Solders, Stress