1-7 of 7
Mei-Chien Lu
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Ultra-High-Density Interconnect Enabled by Hybrid Bonding for Heterogeneous Integration: Interfacial Characteristics

Mei-Chien Lu
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 26–28, 2021
Paper No: IPACK2021-73314
DOI: https://doi.org/10.1115/IPACK2021-73314
View Paper
PDF
Topics: Bonding, Copper, Density, Design, Overlays (Materials engineering)
Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. June 2022, 144(2): 020801.
Paper No: EP-21-1008
DOI: https://doi.org/10.1115/1.4052069
Published Online: September 24, 2021
View Article
PDF
Topics: Sensors, Bonding, Electronics
Proceedings Papers

Enabling Packaging Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 27–29, 2020
Paper No: IPACK2020-2526
DOI: https://doi.org/10.1115/IPACK2020-2526
View Paper
PDF
Topics: Architecture, Bonding, Density, Packaging, Sensors
Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. December 2020, 142(4): 040801.
Paper No: EP-19-1126
DOI: https://doi.org/10.1115/1.4047472
Published Online: June 29, 2020
View Article
PDF
Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals
Proceedings Papers

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A016, October 7–9, 2019
Paper No: IPACK2019-6443
DOI: https://doi.org/10.1115/IPACK2019-6443
View Paper
PDF
Topics: Architecture, Electric vehicles, Silicon, Electronics, Hybrid electric vehicles, Carbon, Cooling, Design, Emissions, Energy gap
Journal Articles

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031002.
Paper No: EP-18-1100
DOI: https://doi.org/10.1115/1.4042984
Published Online: April 10, 2019
View Article
PDF
Topics: Copper, Silver, Stress, Columns (Structural), Electronics, Sintering, Design
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Paper No: IPACK2018-8307
DOI: https://doi.org/10.1115/IPACK2018-8307
View Paper
PDF
Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures