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1-20 of 46
Mehmet Arik
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97266
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97220
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2022, 144(10): 102101.
Paper No: HT-21-1876
Published Online: August 18, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
Published Online: April 28, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011007.
Paper No: EP-19-1020
Published Online: June 23, 2020
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2020, 142(4): 041602.
Paper No: HT-18-1838
Published Online: February 27, 2020
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. August 2019, 11(4): 041020.
Paper No: TSEA-18-1686
Published Online: July 31, 2019
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020907.
Paper No: EP-16-1139
Published Online: June 12, 2017
Proceedings Papers
Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A050, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-65602
Proceedings Papers
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A003, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7097
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48024
Proceedings Papers
Sevket Umut Yuruker, Mehmet Arik, Enes Tamdogan, Rustamjon Melikov, Sedat Nizamoglu, Daniel Aaron Press, Ilkem Durak
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48326
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48094
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
Published Online: October 15, 2015
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2016, 138(2): 021702.
Paper No: HT-14-1698
Published Online: October 13, 2015
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021005.
Paper No: EP-14-1018
Published Online: June 1, 2015
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73031
Proceedings Papers
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A008, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17833
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111009.
Paper No: HT-12-1188
Published Online: September 23, 2013
Journal Articles
Publisher: ASME
Article Type: Heat Transfer Enhancement
J. Heat Mass Transfer. August 2012, 134(8): 081901.
Published Online: May 31, 2012
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