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Mark Seymour
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
Published Online: April 10, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Paper No: IPACK2018-8422
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010907.
Paper No: EP-17-1109
Published Online: March 2, 2018
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Paper No: IPACK2017-74339
Proceedings Papers

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A043, November 13–19, 2015
Paper No: IMECE2015-50782
Proceedings Papers

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A044, November 13–19, 2015
Paper No: IMECE2015-51012
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A017, July 6–9, 2015
Paper No: IPACK2015-48237
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Paper No: IPACK2015-48244
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A016, July 6–9, 2015
Paper No: IPACK2015-48234