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M. H. Gordon
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Proceedings Papers

A Technique for Determining the Mechanical Behavior and Electrical Performance of Thin Films

Li Li, Biao Huang, Q. Qiao, M. H. Gordon, W. F. Schmidt, S. S. Ang
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 545-550, November 14–19, 1999
Paper No: IMECE1999-0319
DOI: https://doi.org/10.1115/IMECE1999-0319
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Topics: Mechanical behavior, Thin films, Bridges (Structures), Probes, Cantilevers, Deflection, Displacement, Electrical resistance, Failure, Finite element model
Proceedings Papers

Mechanical Considerations of Shin-Etsu Elastomer As a Z-Axis Interconnect

C. Cox, W. F. Schmidt, M. H. Gordon, W. Marsh, G. Bates, M. Lucas
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 277-281, November 11–16, 2001
Paper No: IMECE2001/EPP-24736
DOI: https://doi.org/10.1115/IMECE2001/EPP-24736
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Topics: Elastomers, Compression, Young's modulus, Accounting, Boundary-value problems, Composite materials, Copper, Design, Electromagnetic scattering, Electronic packages
Proceedings Papers

Comparison of Laser-Ceramic and Laser-Metal Material Processing

G. Deng, M. H. Gordon, L. A. Roe, A. P. Malshe, W. F. Schmidt
Proc. ASME. IMECE2000, Heat Transfer: Volume 5, 7-11, November 5–10, 2000
Paper No: IMECE2000-1553
DOI: https://doi.org/10.1115/IMECE2000-1553
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Topics: Ceramics, Lasers, Materials processing, Metals, Aluminum, Diamonds, Atoms, Electrons, Plasmas (Ionized gases), Carbon