1-11 of 11
M. Saka
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films

X. Zhao, M. Saka, M. Yamashita, F. Togoh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
https://doi.org/10.1115/1.4001687
Published Online: June 11, 2010
View Article titled, Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films
Open the PDF for Evaluation of the Dominant Factor for Electromigration in Sputtered High Purity Al Films in another window
Topics: Current density, Diffusion (Physics), Electrodiffusion, Grain boundary diffusion, Grain size, Temperature, Sputtering (Irradiation), Circuits, Damage, Strips
Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
https://doi.org/10.1115/1.1326440
Published Online: July 18, 2000
View Article titled, Microwave Imaging for the Integrity Assessment of IC Packages
Open the PDF for Microwave Imaging for the Integrity Assessment of IC Packages in another window
Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes
Journal Articles

Analysis of Interaction of Multiple Cracks in a Direct Current Field and Nondestructive Evaluation

H. Liu, M. Saka, H. Abe', I. Komura, H. Sakamoto
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. June 1999, 66(2): 468–475.
https://doi.org/10.1115/1.2791071
Published Online: October 25, 1999
View Article titled, Analysis of Interaction of Multiple Cracks in a Direct Current Field and Nondestructive Evaluation
Open the PDF for Analysis of Interaction of Multiple Cracks in a Direct Current Field and Nondestructive Evaluation in another window
Topics: Fracture (Materials), Nondestructive evaluation, Cracking (Materials), Fracture (Process), Inverse problems
Journal Articles

Use of Cavitating Jet for Introducing Compressive Residual Stress

H. Soyama, Mem. ASME, Associate Professor, J. D. Park, Professor, M. Saka, Professor
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2000, 122(1): 83–89.
https://doi.org/10.1115/1.538911
Published Online: September 1, 1999
View Article titled, Use of Cavitating Jet for Introducing Compressive Residual Stress
Open the PDF for Use of Cavitating Jet for Introducing Compressive Residual Stress in another window
Topics: Cavitation, Stress
Journal Articles

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

S. Kamiya, H. Takahashi, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 367–371.
https://doi.org/10.1115/1.2792648
Published Online: December 1, 1998
View Article titled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
Open the PDF for Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles in another window
Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Journal Articles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

K. Sasagawa, N. Nakamura, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 360–366.
https://doi.org/10.1115/1.2792647
Published Online: December 1, 1998
View Article titled, A New Approach to Calculate Atomic Flux Divergence by Electromigration
Open the PDF for A New Approach to Calculate Atomic Flux Divergence by Electromigration in another window
Topics: Electrodiffusion, Corners (Structural elements), Current density, Temperature, Computational methods
Journal Articles

A Sensitive Ultrasonic Approach to NDE of Tightly Closed Small Cracks

S. R. Ahmed, M. Saka
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research Papers
J. Pressure Vessel Technol. November 1998, 120(4): 384–392.
https://doi.org/10.1115/1.2842348
Published Online: November 1, 1998
View Article titled, A Sensitive Ultrasonic Approach to NDE of Tightly Closed Small Cracks
Open the PDF for A Sensitive Ultrasonic Approach to NDE of Tightly Closed Small Cracks in another window
Topics: Fracture (Materials), Nondestructive evaluation, Fatigue cracks, Longitudinal waves, Calibration, Computers, Inverse problems, Stress, Ultrasonic testing
Journal Articles

NDE of a 3-D Surface Crack Using Closely Coupled Probes for DCPD Technique

M. Saka, D. Hirota, H. Abe´, I. Komura
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research Papers
J. Pressure Vessel Technol. November 1998, 120(4): 374–378.
https://doi.org/10.1115/1.2842346
Published Online: November 1, 1998
View Article titled, NDE of a 3-D Surface Crack Using Closely Coupled Probes for DCPD Technique
Open the PDF for NDE of a 3-D Surface Crack Using Closely Coupled Probes for DCPD Technique in another window
Topics: Nondestructive evaluation, Probes, Surface cracks, Calibration, Sensors, Fracture (Materials)
Journal Articles

NDE of a Crack by Using Closely Coupled Probes for DCPD Technique

M. Saka, A. Oouchi, H. Abe´
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research Papers
J. Pressure Vessel Technol. May 1996, 118(2): 198–202.
https://doi.org/10.1115/1.2842181
Published Online: May 1, 1996
View Article titled, NDE of a Crack by Using Closely Coupled Probes for DCPD Technique
Open the PDF for NDE of a Crack by Using Closely Coupled Probes for DCPD Technique in another window
Topics: Fracture (Materials), Nondestructive evaluation, Probes, Calibration, Flow (Dynamics)
Journal Articles

Does the Process Zone Control Crack Growth?

H. Abe´, M. Saka, S. Ohba, T. Hashida
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Review Articles
Appl. Mech. Rev. August 1992, 45(8): 367–376.
https://doi.org/10.1115/1.3119765
Published Online: August 1, 1992
View Article titled, Does the Process Zone Control Crack Growth?
Open the PDF for Does the Process Zone Control Crack Growth? in another window
Topics: Fracture (Materials), Separation (Technology), Tension, Displacement, Fracture toughness, Stress
eBook Chapter

A Criterion Based on Crack-Tip Energy Dissipation in Plane-Strain Crack Growth Under Large-Scale Yielding

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1983
ISBN-10: 0-8031-0727-7
ISBN: 978-0-8031-0727-4
Open the PDF for A Criterion Based on Crack-Tip Energy Dissipation in Plane-Strain Crack Growth Under Large-Scale Yielding in another window