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M. Ellis
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Proceedings Papers

An Introductory Course in Thermal Fluid Engineering

I. Sorensen, M. Ellis, C. Dancey, B. Vick, D. Jaasma, T. Diller
Proc. ASME. IMECE2000, Heat Transfer: Volume 1, 315-319, November 5–10, 2000
Paper No: IMECE2000-1399
DOI: https://doi.org/10.1115/IMECE2000-1399
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Topics: Engineering education, Thermofluids, Students, Engineering teachers, Fluid mechanics, Heat transfer, Mechanical engineering, Teaching, Thermodynamics, Feedback
Proceedings Papers

Calibration Systems and Techniques for Automated Microassembly

K. Tsui, A. Geisberger, M. Ellis, G. Skidmore
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 251-255, July 6–11, 2003
Paper No: IPACK2003-35208
DOI: https://doi.org/10.1115/IPACK2003-35208
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Topics: Calibration, Microassembling, Manufacturing, Crystals, End effectors, Geometry, Microelectromechanical systems, Nickel, Robotics, Silicon
Proceedings Papers

Development of a Unique, Passive, Microgravity Vortex Separator

M. Ellis, C. Kurwitz, F. Best
Proc. ASME. IMECE2005, Fluids Engineering, 763-770, November 5–11, 2005
Paper No: IMECE2005-81616
DOI: https://doi.org/10.1115/IMECE2005-81616
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Topics: Vortices, Flow (Dynamics), Phase separation, Design, Rankine cycle, Reduced gravity environments, Separation (Technology), Water, Acoustics, Dehumidification
Journal Articles

A Study of Creep in Polysilicon MEMS Devices

K. Tuck, A. Jungen, A. Geisberger, M. Ellis, G. Skidmore
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. January 2005, 127(1): 90–96.
DOI: https://doi.org/10.1115/1.1839214
Published Online: February 22, 2005
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Topics: Creep, Deformation, Microelectromechanical systems, Polysilicon, Stress, Temperature, Failure, Thin films, High temperature