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Luís Ribas
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Journal Articles

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha F. C. F. Teixeira, José Carlos Teixeira
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011011.
Paper No: EP-21-1002
https://doi.org/10.1115/1.4050981
Published Online: August 6, 2021
View Article titled, Numerical Modeling of the Wave Soldering Process and Experimental Validation
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Topics: Computer simulation, Soldering, Solders, Wave soldering, Waves, Strain measurement, Fluids
Proceedings Papers

Modeling the Reflow Soldering Process in PCB’s

João Costa, Delfim Soares, Senhorinha F. Teixeira, Fátima Cerqueira, Francisco Macedo, Nelson Rodrigues, Luis Ribas, José Carlos Teixeira
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A014, July 6–9, 2015
Paper No: IPACK2015-48720
https://doi.org/10.1115/IPACK2015-48720
View Paper titled, Modeling the Reflow Soldering Process in PCB’s
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Topics: Alloys, Computational fluid dynamics, Computer software, Copper, Enthalpy, Fluids, Geometry, Heat of fusion, Materials properties, Melting
Proceedings Papers

Numerical Modeling of Wave Soldering in PCB

Bruno Arcipreste, Delfim Soares, Luis Ribas, José Carlos Teixeira
Proc. ASME. IMECE2014, Volume 2B: Advanced Manufacturing, V02BT02A045, November 14–20, 2014
Paper No: IMECE2014-39051
https://doi.org/10.1115/IMECE2014-39051
View Paper titled, Numerical Modeling of Wave Soldering in PCB
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Topics: Computer simulation, Wave soldering, Solders, Manufacturing, Capillarity, Computational fluid dynamics, Diluents, Drag (Fluid dynamics), Electronic components, Electronics