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Journal Articles

Experimental Evidence of the Thermal Cloak Based on the Path Design of the Heat Flux

Xiao He, Tianzhi Yang, Linzhi Wu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2018, 140(10): 102001.
Paper No: HT-17-1685
https://doi.org/10.1115/1.4040148
Published Online: May 25, 2018
View Article titled, Experimental Evidence of the Thermal Cloak Based on the Path Design of the Heat Flux
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Topics: Design, Heat flux, Transients (Dynamics), Heat conduction
Journal Articles

Cylindrical Thermal Cloak Based on the Path Design of Heat Flux

Linzhi Wu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. February 2015, 137(2): 021301.
Paper No: HT-14-1337
https://doi.org/10.1115/1.4028920
Published Online: February 1, 2015
View Article titled, Cylindrical Thermal Cloak Based on the Path Design of Heat Flux
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Topics: Design, Heat flux, Heat conduction, Heat, Differential equations, Temperature, Flow (Dynamics)
Journal Articles

Investigation of Stress Intensity Factors for an Interface Crack in Multi-Interface Materials Using an Interaction Integral Method

Linzhi Wu, Hongjun Yu, Licheng Guo, Qilin He, Shanyi Du
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. November 2011, 78(6): 061007.
https://doi.org/10.1115/1.4003906
Published Online: August 24, 2011
View Article titled, Investigation of Stress Intensity Factors for an Interface Crack in Multi-Interface Materials Using an Interaction Integral Method
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Topics: Fracture (Materials), Stress
Journal Articles

The Thermoelastic Analysis of Chip-Substrate System

Linzhi Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 325–332.
https://doi.org/10.1115/1.1772413
Published Online: October 6, 2004
View Article titled, The Thermoelastic Analysis of Chip-Substrate System
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Topics: Fourier series, Heat conduction, Integrated circuits, Stress, Temperature, Thermal stresses, Thermoelasticity, Stress concentration, Reliability, Heat
Journal Articles

The Elastic Field Caused by a Circular Cylindrical Inclusion—Part I: Inside the Region x 1 2 + x 2 2 < a 2 , − ∞ < x 3 < ∞ Where the Circular Cylindrical Inclusion is Expressed by x 1 2 + x 2 2 ≤ a 2 , − h ≤ x 3 ≤ h

Linzhi Wu, Shanyi Du
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 1995, 62(3): 579–584.
https://doi.org/10.1115/1.2895984
Published Online: September 1, 1995
View Article titled, The Elastic Field Caused by a Circular Cylindrical Inclusion—Part I: Inside the Region x 1 2 + x 2 2 &lt; a 2 , − ∞ &lt; x 3 &lt; ∞ Where the Circular Cylindrical Inclusion is Expressed by x 1 2 + x 2 2 ≤ a 2 , − h ≤ x 3 ≤ h
Open the PDF for The Elastic Field Caused by a Circular Cylindrical Inclusion—Part I: Inside the Region x 1 2 + x 2 2 < a 2 , − ∞ < x 3 < ∞ Where the Circular Cylindrical Inclusion is Expressed by x 1 2 + x 2 2 ≤ a 2 , − h ≤ x 3 ≤ h in another window
Topics: Displacement, Stress
Journal Articles

The Elastic Field Caused by a Circular Cylindrical Inclusion—Part II: Inside the Region x 1 2 + x 2 2 > a 2 , − ∞ < x 3 < ∞ Where the Circular Cylindrical Inclusion is Expressed by x 1 2 + x 2 2 ≤ a 2 , − h ≤ x 3 ≤ h

Linzhi Wu, Shanyi Y. Du
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 1995, 62(3): 585–589.
https://doi.org/10.1115/1.2895985
Published Online: September 1, 1995
View Article titled, The Elastic Field Caused by a Circular Cylindrical Inclusion—Part II: Inside the Region x 1 2 + x 2 2 &gt; a 2 , − ∞ &lt; x 3 &lt; ∞ Where the Circular Cylindrical Inclusion is Expressed by x 1 2 + x 2 2 ≤ a 2 , − h ≤ x 3 ≤ h
Open the PDF for The Elastic Field Caused by a Circular Cylindrical Inclusion—Part II: Inside the Region x 1 2 + x 2 2 > a 2 , − ∞ < x 3 < ∞ Where the Circular Cylindrical Inclusion is Expressed by x 1 2 + x 2 2 ≤ a 2 , − h ≤ x 3 ≤ h in another window
Topics: Displacement, Stress