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Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
DOI: https://doi.org/10.1115/1.4040499
Published Online: July 2, 2018
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Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks
Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
DOI: https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017
Paper No: IPACK2017-74169
DOI: https://doi.org/10.1115/IPACK2017-74169
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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness
Proceedings Papers

Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders

Qian Jiang, Subhasis Mukherjee, Bastian Vogt, Abhijit Dasgupta, David Shaddock, Liang Yin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A005, July 6–9, 2015
Paper No: IPACK2015-48708
DOI: https://doi.org/10.1115/IPACK2015-48708
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Topics: High temperature, Solders, Temperature, Stress, Creep, Equipment performance, Mechanical properties, Melting, Wire
Proceedings Papers

Highly Manufacturable and Reliable CZT Detectors

Bill Burdick, Jeff Erlbaum, Kaustubh Nagarkar, Brian Yanoff, Liang Yin, Raj Bahadur, Esmaeil Heidari, Donna Sherman, James E. Simpson
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A007, July 16–18, 2013
Paper No: IPACK2013-73314
DOI: https://doi.org/10.1115/IPACK2013-73314
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Topics: Sensors, Reliability, Design, Finite element model, Manufacturing, Packaging, Radiation detectors, Semiconductors (Materials), Accelerated life testing, Ceramics
Proceedings Papers

Recrystallization of Lead Free Solder Joints: Confounding the Interpretation of Accelerated Thermal Cycling Results?

Ahmad Mayyas, Liang Yin, Peter Borgesen
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 319-326, November 13–19, 2009
Paper No: IMECE2009-12749
DOI: https://doi.org/10.1115/IMECE2009-12749
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Topics: Lead-free solders, Recrystallization, Damage, Cracking (Materials), Failure, Fracture (Process), Reliability, Vibration, Ball-Grid-Array packaging, Engineers