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Proceedings Papers

Contactless Li-Ion Battery Voltage Detection by Using Walabot and Machine Learning

Yanan Wang, Haoyu Niu, Tiebiao Zhao, Xiaozhong Liao, Lei Dong, Yangquan Chen
Proc. ASME. IDETC-CIE2019, Volume 9: 15th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications, V009T12A002, August 18–21, 2019
Paper No: DETC2019-97668
DOI: https://doi.org/10.1115/DETC2019-97668
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Topics: Lithium-ion batteries, Machine learning, Algorithms, Principal component analysis, Sensors
eBook Chapter

Data Complementation Method and Application for Incomplete Information System Based on Rough Sets

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859902
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Topics: Surface roughness
Proceedings Papers

Estimation of Temperature Distribution in Silicon During Micro Laser Assisted Machining

Kamlesh J. Suthar, John Patten, Lei Dong, Hisham Abdel-Aal
Proc. ASME. MSEC2008, ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2, 301-309, October 7–10, 2008
Paper No: MSEC_ICM&P2008-72195
DOI: https://doi.org/10.1115/MSEC_ICMP2008-72195
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Topics: Lasers, Machining, Silicon, Temperature distribution, Diamond tools, Temperature, Cutting, Laser beams, Heat, Abrasives
Proceedings Papers

Improving the Performance of Time-Triggered Embedded Systems by Means of a Scheduler Agent

Ayman K. Gendy, Lei Dong, Michael J. Pont
Proc. ASME. IDETC-CIE2007, Volume 4: ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications and the 19th Reliability, Stress Analysis, and Failure Prevention Conference, 57-63, September 4–7, 2007
Paper No: DETC2007-35369
DOI: https://doi.org/10.1115/DETC2007-35369
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Topics: Embedded systems, Algorithms, Control systems, Energy consumption, Errors, Jitter, System architecture
Proceedings Papers

Laser Heating and Thermally Enhanced Deformation of Silicon

Lei Dong, John A. Patten
Proc. ASME. MSEC2007, ASME 2007 International Manufacturing Science and Engineering Conference, 305-309, October 15–18, 2007
Paper No: MSEC2007-31014
DOI: https://doi.org/10.1115/MSEC2007-31014
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Topics: Deformation, Heating, Lasers, Silicon, Machining, Ceramics, Cutting tools, Diamonds, Semiconductors (Materials), Fiber lasers