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Katsuhiro Koizumi
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Proceedings Papers

CFD - Based Investigation of Effects of Obstruction in Front of Small Axial Cooling Fan and Deterioration of Supply Flow Rate

Tetsushi Fukuda, Yukio Masuda, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka, Katsuhiro Koizumi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021
Paper No: IPACK2021-72976
DOI: https://doi.org/10.1115/IPACK2021-72976
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Topics: Computational fluid dynamics, Cooling, Flow (Dynamics), Impellers, Density, Electronic equipment, Packaging, Fans, Flow visualization, Pressure
Proceedings Papers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015
Paper No: IPACK2015-48600
DOI: https://doi.org/10.1115/IPACK2015-48600
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Topics: Density, Electronic equipment, Flow (Dynamics), Network analysis, Packaging, Air flow, Computational fluid dynamics, Cooling, Design, Diluents
Proceedings Papers

CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)

Kazunori Inagaki, Shinji Nakagawa, Tomoyuki Hatakeyama, Koichi Ishikura, Katsuhiro Koizumi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A022, July 16–18, 2013
Paper No: IPACK2013-73275
DOI: https://doi.org/10.1115/IPACK2013-73275
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Topics: Computational fluid dynamics, Simulation, Wave soldering, Solders, Computer software, Electronics, Flow (Dynamics), Fluids, Melting, Melting point
Proceedings Papers

Relationships Between Supply Flow Rate of Small Cooling Fans and Pressure Drop Characteristics in Electronic Enclosure

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Katsuhiro Koizumi
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A020, July 16–18, 2013
Paper No: IPACK2013-73089
DOI: https://doi.org/10.1115/IPACK2013-73089
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Topics: Cooling, Fans, Flow (Dynamics), Pressure drop, Density, Packaging, Pressure, Design, Electronic equipment
Proceedings Papers

Study on P-Q Curves of Cooling Fans for Thermal Design of Electronic Equipment (Effects of Opening Position of Obstructions Near a Fan)

Takashi Fukue, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa, Katsuhiro Koizumi
Proc. ASME. AJK2011, ASME-JSME-KSME 2011 Joint Fluids Engineering Conference: Volume 1, Symposia – Parts A, B, C, and D, 737-745, July 24–29, 2011
Paper No: AJK2011-22054
DOI: https://doi.org/10.1115/AJK2011-22054
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Topics: Cooling, Design, Electronic equipment, Fans, Flow (Dynamics), Pressure, Density, Capacitors, Electronic components, Heat sinks
Proceedings Papers

Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity

Wataru Nakayama, Katsuhiro Koizumi, Takashi Fukue, Masaru Ishizuka, Tatsuya Nakajima, Hiroko Koike, Ryuichi Matsuki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 297-310, July 19–23, 2009
Paper No: InterPACK2009-89086
DOI: https://doi.org/10.1115/InterPACK2009-89086
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Topics: Density, Thermal characterization, Thermal conductivity, Metals, Flow (Dynamics), Heat, Heat conduction, Copper, Electrical wires, Japan Society of Mechanical Engineers
Proceedings Papers

Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling

Takashi Fukue, Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 479-490, July 19–23, 2009
Paper No: InterPACK2009-89219
DOI: https://doi.org/10.1115/InterPACK2009-89219
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Topics: Computer cooling, Porosity, Vents, Flow (Dynamics), Cooling, Density, Fans, Pressure
Proceedings Papers

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009
Paper No: InterPACK2009-89052
DOI: https://doi.org/10.1115/InterPACK2009-89052
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Topics: Capacitors, Electronic equipment, Modeling, Computational fluid dynamics, Flow simulation, Temperature, Design, Flow (Dynamics), Switches, Thermal analysis
Proceedings Papers

Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 713-718, July 8–12, 2007
Paper No: HT2007-32100
DOI: https://doi.org/10.1115/HT2007-32100
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Topics: Electronic equipment, Flow (Dynamics), Plates (structures), Shapes, Experimental design, Reynolds number, Natural convection
Proceedings Papers

Experimental Study on Thermal Performance of a Forced Air Cooled PBGA Package in the Compact Thin Casing: Effect of Obstacles Placed Inside the Casing

Masaru Ishizuka, Shinji Nakagawa, Katsuhiro Koizumi
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 297-304, November 11–15, 2007
Paper No: IMECE2007-41112
DOI: https://doi.org/10.1115/IMECE2007-41112
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Topics: Computational fluid dynamics, Design, Dynamic light scattering, Engineering simulation, Flow (Dynamics), Heat, Laptop computers, Printed circuit boards, Simulation, Temperature
Proceedings Papers

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Katsuhiro Koizumi, Masaru Ishizuka
Proc. ASME. HT-FED2004, Volume 4, 265-272, July 11–15, 2004
Paper No: HT-FED2004-56062
DOI: https://doi.org/10.1115/HT-FED2004-56062
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Topics: Circuit design, Cooling, Design, Electronic equipment, Flow simulation, Natural convection, Power semiconductor devices, Computational fluid dynamics, Heat, Circuits
Proceedings Papers

Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

Katsuhiro Koizumi, Akito Joboji, Kuniaki Nagahara, Masaru Ishizuka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 103-109, July 6–11, 2003
Paper No: IPACK2003-35048
DOI: https://doi.org/10.1115/IPACK2003-35048
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Topics: Natural convection, Switches, Thermal analysis, Power semiconductor devices, Computational methods, Design, Experimental design, Flow simulation, Heat, Modeling
Proceedings Papers

Influence of Proximity-Effect Loss on Surface Temperature Distribution of High-Frequency Inductors

Katsuhiro Koizumi, Masaru Ishizuka
Proc. ASME. IMECE2004, Heat Transfer, Volume 2, 135-141, November 13–19, 2004
Paper No: IMECE2004-59039
DOI: https://doi.org/10.1115/IMECE2004-59039
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Topics: Inductors, Temperature distribution, Winding (process), Temperature, Anisotropy, Modeling, Thermal conductivity, Computer simulation, Switches
Proceedings Papers

Practical Study of Application of Thermal Network Method to Thermal Design of Electronic Equipment: An Example for the Thermal Design of a Compact Self-Ballasted Fluorescent Lamp

Masaru Ishizuka, Shinji Nakagawa, Katsuhiro Koizumi
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 1-7, November 5–10, 2006
Paper No: IMECE2006-13105
DOI: https://doi.org/10.1115/IMECE2006-13105
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Topics: Design, Electronic equipment, Temperature, Network models, Simulation