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K.-F. Becker
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Journal Articles

A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing

K.-F. Becker, T. Braun, A. Neumann, A. Ostmann, E. Coko, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl
Journal: Journal of Electronic Packaging
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 1–6.
DOI: https://doi.org/10.1115/1.1846058
Published Online: March 21, 2005
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Topics: Lasers, Manufacturing, Packaging, Reliability, Semiconductor wafers, System-in-package, Flip-chip devices, Epoxy adhesives, Epoxy resins