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Proceedings Papers

An Implementation of Concurrent Engineering Concept to Injection Molding

K. K. Wang

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 1-14, November 16–21, 1997

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1997-0616

https://doi.org/10.1115/IMECE1997-0616

View Paper titled, An Implementation of Concurrent Engineering Concept to Injection Molding

Topics: Concurrent engineering, Injection molding, Design, Manufacturing, Molding, Optimization, Process control, Shapes

Proceedings Papers

An Optimization Scheme for Part Quality in Injection Molding

Hua Ye, YingHui Wu, K. K. Wang

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 139-149, November 16–21, 1997

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1997-0625

https://doi.org/10.1115/IMECE1997-0625

View Paper titled, An Optimization Scheme for Part Quality in Injection Molding

Topics: Injection molding, Optimization, Simulated annealing, Warping, Computer simulation, Exhaust systems, Optimization algorithms, Tensors

Proceedings Papers

Five-Axis Swept Volumes for Graphic NC Simulation and Verification

K. Sambandan, K. K. Wang

Proc. ASME. DETC89, 15th Design Automation Conference: Volume 1 — Computer-Aided and Computational Design, 143-150, September 17–21, 1989

Publisher: American Society of Mechanical Engineers

Paper No: DETC1989-0030

https://doi.org/10.1115/DETC1989-0030

View Paper titled, Five-Axis Swept Volumes for Graphic NC Simulation and Verification

Topics: Algorithms, Cutting, Machining, Milling, Polishing equipment, Simulation

Journal Articles

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Sejin Han, K. K. Wang

Publisher: ASME

J. Electron. Packag. March 2000, 122(1): 20–27.

https://doi.org/10.1115/1.483127

Published Online: August 17, 1999

View Article titled, Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Topics: Cavities, Flow (Dynamics), Hardening (Curing), Molding, Packing (Shipments), Packings (Cushioning), Pressure, Semiconductors (Materials), Temperature, Viscosity

Journal Articles

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

S. Han, K. K. Wang

Publisher: ASME

J. Electron. Packag. June 2000, 122(2): 160–167.

https://doi.org/10.1115/1.483149

Published Online: January 11, 1999

View Article titled, Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

Topics: Cavities, Cross-flow, Flow (Dynamics), Molding, Epoxy adhesives, Epoxy resins, Semiconductors (Materials)

Journal Articles

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

S. Han, K. K. Wang, D. L. Crouthamel

Publisher: ASME

J. Electron. Packag. December 1997, 119(4): 247–254.

https://doi.org/10.1115/1.2792245

Published Online: December 1, 1997

View Article titled, Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

Topics: Semiconductors (Materials), Wire, Cavities, Epoxy adhesives, Epoxy resins, Manufacturing, Materials properties, Molding, Shapes, Temperature

Journal Articles

A Method for Extracting and Thickening a Mid-Surface of a 3D Thin Object Represented in NURBS

A. Fischer, K. K. Wang

Publisher: ASME

J. Manuf. Sci. Eng. November 1997, 119(4B): 706–712.

https://doi.org/10.1115/1.2836813

Published Online: November 1, 1997

View Article titled, A Method for Extracting and Thickening a Mid-Surface of a 3D Thin Object Represented in NURBS

Topics: Algorithms, Computer-aided design, Design, Die casting (Process), Die castings (Product), Engineering simulation, Flow (Dynamics), Geometry, Injection molding, Manufacturing

Journal Articles

Elastic Buckling of a Circular Disk due to Internal Membrane Forces

W.-Y. Shih, L. Kudryavtsev, K. K. Wang

Publisher: ASME

J. Appl. Mech. September 1995, 62(3): 813–816.

https://doi.org/10.1115/1.2777115

Published Online: September 1, 1995

View Article titled, Elastic Buckling of a Circular Disk due to Internal Membrane Forces

Topics: Buckling, Disks, Membranes, Temperature distribution, Deformation, Shapes, Stress, Structural mechanics, Temperature

Journal Articles

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Sejin Han, K. K. Wang

Publisher: ASME

J. Electron. Packag. September 1995, 117(3): 178–184.

https://doi.org/10.1115/1.2792089

Published Online: September 1, 1995

View Article titled, A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Topics: Semiconductors (Materials), Wire, Deformation, Flow (Dynamics), Bubbles, Cavities, Fluids, Model development, Shapes, Transfer molding

Journal Articles

Numerical Simulation of the Coinjection Molding Process

L. S. Turng, V. W. Wang, K. K. Wang

Publisher: ASME

J. Eng. Mater. Technol. January 1993, 115(1): 48–53.

https://doi.org/10.1115/1.2902156

Published Online: January 1, 1993

View Article titled, Numerical Simulation of the Coinjection Molding Process

Topics: Computer simulation, Molding, Polymer melts, Cavities, Engineers, Flow (Dynamics), Injection molding, Laminates, Materials properties, Numerical analysis

Journal Articles

Integrated Simulation of Fluid Flow and Heat Transfer in Injection Molding for the Prediction of Shrinkage and Warpage

H. H. Chiang, K. Himasekhar, N. Santhanam, K. K. Wang

Publisher: ASME

J. Eng. Mater. Technol. January 1993, 115(1): 37–47.

https://doi.org/10.1115/1.2902155

Published Online: January 1, 1993

View Article titled, Integrated Simulation of Fluid Flow and Heat Transfer in Injection Molding for the Prediction of Shrinkage and Warpage

Topics: Fluid dynamics, Heat transfer, Injection molding, Shrinkage (Materials), Simulation, Warping, Polymer melts, Cooling, Flow (Dynamics), Temperature

Journal Articles

CAE of Mold Cooling in Injection Molding Using a Three-Dimensional Numerical Simulation

K. Himasekhar, J. Lottey, K. K. Wang

Publisher: ASME

J. Manuf. Sci. Eng. May 1992, 114(2): 213–221.

https://doi.org/10.1115/1.2899774

Published Online: May 1, 1992

View Article titled, CAE of Mold Cooling in Injection Molding Using a Three-Dimensional Numerical Simulation

Topics: Computer simulation, Computer-aided engineering, Cooling, Injection molding, Cooling systems, Heat transfer, Design, Heat, Heat conduction, Simulation

Journal Articles

A Computer-Aided Cooling-Line Design System for Injection Molds

L. S. Turng, K. K. Wang

Publisher: ASME

J. Manuf. Sci. Eng. May 1990, 112(2): 161–167.

https://doi.org/10.1115/1.2899560

Published Online: May 1, 1990

View Article titled, A Computer-Aided Cooling-Line Design System for Injection Molds

Topics: Computer-aided engineering, Cooling, Design, Cycles, Temperature, Boundary element methods, Cavities, Heat transfer, Transients (Dynamics), Boundary-value problems

Journal Articles

Geometric Representation of Translational Swept Volumes and its Applications

M. C. Leu, S. H. Park, K. K. Wang

Publisher: ASME

J. Manuf. Sci. Eng. May 1986, 108(2): 113–119.

https://doi.org/10.1115/1.3187045

Published Online: May 1, 1986

View Article titled, Geometric Representation of Translational Swept Volumes and its Applications

Topics: Casting, Cylinders, Rendering, Robots

Journal Articles

Optimization of Inertia Welding Process by Response Surface Methodology

K. K. Wang, G. Rasmussen

Publisher: ASME

J. Manuf. Sci. Eng. November 1972, 94(4): 999–1006.

https://doi.org/10.1115/1.3428352

Published Online: November 1, 1972

View Article titled, Optimization of Inertia Welding Process by Response Surface Methodology

Topics: Friction welding, Optimization, Response surface methodology, Welding, Carbon, Deformation, Steel

Journal Articles

Erratum: “An Analysis of Punching Variables by Two-Level Fractional Factorial Design” (Journal of Engineering for Industry, 1970, 92, pp. 435–443)

K. K. Wang, Khalil Taraman, S. M. Wu

Publisher: ASME

J. Manuf. Sci. Eng. August 1970, 92(3): 715–716.

https://doi.org/10.1115/1.3427836

Published Online: August 1, 1970

View Article titled, Erratum: “An Analysis of Punching Variables by Two-Level Fractional Factorial Design” (Journal of Engineering for Industry, 1970, 92, pp. 435–443)

Topics: Design, Punching (Metalworking)

Journal Articles

Closure to “Discussions of ‘An Analysis of Punching Variables by Two-Level Fractional Factorial Design’” (1970, ASME J. Eng. Ind., 92, p. 443)

K. K. Wang, Khalil Taraman, S. M. Wu

Publisher: ASME

J. Manuf. Sci. Eng. May 1970, 92(2): 443.

https://doi.org/10.1115/1.3427775

Published Online: May 1, 1970

View Article titled, Closure to “Discussions of ‘An Analysis of Punching Variables by Two-Level Fractional Factorial Design’” (1970, ASME J. Eng. Ind., 92, p. 443)

Topics: Punching (Metalworking)

Journal Articles

An Analysis of Punching Variables by Two-Level Fractional Factorial Design

K. K. Wang, Khalil Taraman, S. M. Wu

Publisher: ASME

J. Manuf. Sci. Eng. May 1970, 92(2): 435–442.

https://doi.org/10.1115/1.3427772

Published Online: May 1, 1970

View Article titled, An Analysis of Punching Variables by Two-Level Fractional Factorial Design

Topics: Design, Punching (Metalworking), Fracture (Materials), Fracture (Process), Experimental design

Journal Articles

Investigation of Face-Milling Tool Temperatures by Simulation Techniques

K. K. Wang, K. C. Tsao, S. M. Wu

Publisher: ASME

J. Manuf. Sci. Eng. August 1969, 91(3): 772–779.

https://doi.org/10.1115/1.3591689

Published Online: August 1, 1969

View Article titled, Investigation of Face-Milling Tool Temperatures by Simulation Techniques

Topics: Milling, Simulation, Temperature, Temperature distribution, Cutting, Computer simulation, Numerical analysis

Journal Articles

Closure to “Discussion of ‘Investigation of Face-Milling Tool Temperatures by Simulation Techniques’” (1969, ASME J. Eng. Ind., 91, p. 779)

K. K. Wang, K. C. Tsao, S. M. Wu

Publisher: ASME

J. Manuf. Sci. Eng. August 1969, 91(3): 780.

https://doi.org/10.1115/1.3591691

Published Online: August 1, 1969

View Article titled, Closure to “Discussion of ‘Investigation of Face-Milling Tool Temperatures by Simulation Techniques’” (1969, ASME J. Eng. Ind., 91, p. 779)

Topics: Milling, Simulation, Temperature

Journal citation

NARROW

An Implementation of Concurrent Engineering Concept to Injection Molding

An Optimization Scheme for Part Quality in Injection Molding

Five-Axis Swept Volumes for Graphic NC Simulation and Verification

Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation

Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

A Method for Extracting and Thickening a Mid-Surface of a 3D Thin Object Represented in NURBS

Elastic Buckling of a Circular Disk due to Internal Membrane Forces

A Study on Wire Sweep in Encapsulation of Semiconductor Chips Using Simulated Experiments

Numerical Simulation of the Coinjection Molding Process

Integrated Simulation of Fluid Flow and Heat Transfer in Injection Molding for the Prediction of Shrinkage and Warpage

CAE of Mold Cooling in Injection Molding Using a Three-Dimensional Numerical Simulation

A Computer-Aided Cooling-Line Design System for Injection Molds

Geometric Representation of Translational Swept Volumes and its Applications

Optimization of Inertia Welding Process by Response Surface Methodology

Erratum: “An Analysis of Punching Variables by Two-Level Fractional Factorial Design” (Journal of Engineering for Industry, 1970, 92, pp. 435–443)

Closure to “Discussions of ‘An Analysis of Punching Variables by Two-Level Fractional Factorial Design’” (1970, ASME J. Eng. Ind., 92, p. 443)

An Analysis of Punching Variables by Two-Level Fractional Factorial Design

Investigation of Face-Milling Tool Temperatures by Simulation Techniques

Closure to “Discussion of ‘Investigation of Face-Milling Tool Temperatures by Simulation Techniques’” (1969, ASME J. Eng. Ind., 91, p. 779)

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