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Juan-Sebastian Rincon-Tabares
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Journal Articles

Characterizing the Adhesion Between Thin Films and Rigid Substrates Using Digital Image Correlation-Informed Inverse Finite Elements and the Blister Test

Drishya Dahal, Juan-Sebastian Rincon-Tabares, David Y. Risk-Mora, Brendy C. Rincon Troconis, David Restrepo
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. November 2023, 90(11): 111008.
Paper No: JAM-23-1185
https://doi.org/10.1115/1.4062907
Published Online: August 3, 2023
View Article titled, Characterizing the Adhesion Between Thin Films and Rigid Substrates Using Digital Image Correlation-Informed Inverse Finite Elements and the Blister Test
Open the PDF for Characterizing the Adhesion Between Thin Films and Rigid Substrates Using Digital Image Correlation-Informed Inverse Finite Elements and the Blister Test in another window
Topics: Adhesion, Adhesives, Displacement, Finite element analysis, Finite element methods, Fracture (Materials), Fracture (Process), Pressure, Separation (Technology), Simulation
Journal Articles

HYPAD-UQ: A Derivative-Based Uncertainty Quantification Method Using a Hypercomplex Finite Element Method

Matthew Balcer, Mauricio Aristizabal, Juan-Sebastian Rincon-Tabares, Arturo Montoya, David Restrepo, Harry Millwater
Journal: Journal of Verification, Validation and Uncertainty Quantification
Publisher: ASME
Article Type: Research-Article
J. Verif. Valid. Uncert. June 2023, 8(2): 021002.
Paper No: VVUQ-22-1028
https://doi.org/10.1115/1.4062459
Published Online: June 13, 2023
View Article titled, HYPAD-UQ: A Derivative-Based Uncertainty Quantification Method Using a Hypercomplex Finite Element Method
Open the PDF for HYPAD-UQ: A Derivative-Based Uncertainty Quantification Method Using a Hypercomplex Finite Element Method in another window
Topics: Algebra, Errors, Finite element analysis, Uncertainty quantification, Finite element methods, Temperature