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Joshua Gess
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Paper No: IPACK2021-74108
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041101.
Paper No: EP-21-1034
Published Online: August 9, 2021
Journal Articles
Article Type: Research-Article
J. Heat Transfer. July 2021, 143(7): 072501.
Paper No: HT-20-1405
Published Online: May 17, 2021
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041007.
Paper No: EP-16-1051
Published Online: October 20, 2016
Proceedings Papers

Proc. ASME. IMECE2015, Volume 8A: Heat Transfer and Thermal Engineering, V08AT10A032, November 13–19, 2015
Paper No: IMECE2015-51999
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Paper No: IPACK2015-48771
Proceedings Papers

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A084, November 14–20, 2014
Paper No: IMECE2014-38866