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Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031013.
Paper No: EP-18-1104
DOI: https://doi.org/10.1115/1.4044373
Published Online: September 19, 2019
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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Paper No: IPACK2018-8456
DOI: https://doi.org/10.1115/IPACK2018-8456
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux