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John Lau
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Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 163-168, November 11–16, 2001
Paper No: IMECE2001/EPP-24720
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 297-304, July 6–8, 2011
Paper No: IPACK2011-52204
Proceedings Papers

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 387-394, November 15–21, 2003
Paper No: IMECE2003-42253
Proceedings Papers

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 265-270, November 13–19, 2004
Paper No: IMECE2004-62493
Proceedings Papers

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 257-263, November 13–19, 2004
Paper No: IMECE2004-62492
Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 23-28, November 5–11, 2005
Paper No: IMECE2005-79984
Proceedings Papers

Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 299-324, November 5–11, 2005
Paper No: IMECE2005-79981
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