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Proc. ASME. IDETC-CIE2012, Volume 7: 9th International Conference on Design Education; 24th International Conference on Design Theory and Methodology, 77-83, August 12–15, 2012

Paper No: DETC2012-71503

DOI: https://doi.org/10.1115/DETC2012-71503

View Paper titled, Evolution of Velovations: A Bicycle Design Enterprise in Lieu of Capstone Design

Topics: Bicycles, Design, Students, Undergraduate students, Biomedical engineering, Civil engineering, Computer engineering, Computers, Electrical engineering, Engineers

Proceedings Papers

Affordances in Technology Modeling

Benjamin T. Ciavola, John K. Gershenson

Proc. ASME. IDETC-CIE2012, Volume 7: 9th International Conference on Design Education; 24th International Conference on Design Theory and Methodology, 365-372, August 12–15, 2012

Paper No: DETC2012-71432

DOI: https://doi.org/10.1115/DETC2012-71432

View Paper titled, Affordances in Technology Modeling

Topics: Modeling, Accounting, Complex systems, Design, Dynamics (Mechanics)

Proceedings Papers

Empathic Design for Early-Stage Problem Identification

Benjamin Ciavola, Yan Ning, John K. Gershenson

Proc. ASME. IDETC-CIE2010, Volume 5: 22nd International Conference on Design Theory and Methodology; Special Conference on Mechanical Vibration and Noise, 267-276, August 15–18, 2010

Paper No: DETC2010-29111

DOI: https://doi.org/10.1115/DETC2010-29111

View Paper titled, Empathic Design for Early-Stage Problem Identification

Topics: Design

Proceedings Papers

DSM-Based Product Representation for Retirement Process-Based Modularity

Xiaoxia Lai, John K. Gershenson

Proc. ASME. IDETC-CIE2009, Volume 8: 14th Design for Manufacturing and the Life Cycle Conference; 6th Symposium on International Design and Design Education; 21st International Conference on Design Theory and Methodology, Parts A and B, 59-72, August 30–September 2, 2009

Paper No: DETC2009-87037

DOI: https://doi.org/10.1115/DETC2009-87037

View Paper titled, DSM-Based Product Representation for Retirement Process-Based Modularity

Topics: Cable reels, Cycles, Design, Design methodology, Manufacturing, Product design, Recycling, Tooling

Proceedings Papers

DSM-Based Product Representation for Design Process Modularity

Xiaoxia Lai, John K. Gershenson

Proc. ASME. IDETC-CIE2008, Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems, 309-321, August 3–6, 2008

Paper No: DETC2008-49963

DOI: https://doi.org/10.1115/DETC2008-49963

View Paper titled, DSM-Based Product Representation for Design Process Modularity

Topics: Design

Proceedings Papers

Focused Product Family Improvement

Xiaoli Ye, John K. Gershenson

Proc. ASME. IDETC-CIE2008, Volume 1: 34th Design Automation Conference, Parts A and B, 1043-1052, August 3–6, 2008

Paper No: DETC2008-49597

DOI: https://doi.org/10.1115/DETC2008-49597

View Paper titled, Focused Product Family Improvement

Topics: Failure, Tradeoffs

Proceedings Papers

Technology Change Analysis for Product and Product Platform Design

Kiran Khadke, John K. Gershenson

Proc. ASME. IDETC-CIE2007, Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B, 461-470, September 4–7, 2007

Paper No: DETC2007-35121

DOI: https://doi.org/10.1115/DETC2007-35121

View Paper titled, Technology Change Analysis for Product and Product Platform Design

Topics: Design, Innovation, Product design, Cascades (Fluid dynamics), Design methodology, Diffusion (Physics)

Proceedings Papers

Attribute Attribute-Based Clustering for Product Family Design

Xiaoli Ye, John K. Gershenson

Paper No: DETC2007-34885

DOI: https://doi.org/10.1115/DETC2007-34885

View Paper titled, Attribute Attribute-Based Clustering for Product Family Design

Topics: Design, Tradeoffs, Engineering design processes, Product development

Proceedings Papers

Representation of Similarity and Dependency for Manufacturing Process-Based Product Modularity

Xiaoxia Lai, John K. Gershenson

Proc. ASME. IDETC-CIE2007, Volume 4: ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications and the 19th Reliability, Stress Analysis, and Failure Prevention Conference, 791-805, September 4–7, 2007

Paper No: DETC2007-35120

DOI: https://doi.org/10.1115/DETC2007-35120