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Jiro Utsunomiya
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Proceedings Papers

Reliability Analysis of Solderless Press-Fit Interconnections

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 611-615, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33264
https://doi.org/10.1115/IPACK2007-33264
View Paper titled, Reliability Analysis of Solderless Press-Fit Interconnections
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Topics: Event history analysis, Press fits, Manufacturing, Stress, Friction, Printed circuit boards, Damage, Displacement, Failure, Finite element analysis
Journal Articles

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Jiro Utsunomiya, Takeshi Nakamura, Yoshikatsu Nakano
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031007.
https://doi.org/10.1115/1.2957330
Published Online: July 30, 2008
View Article titled, Analysis of Solderless Press-Fit Interconnections During the Assembly Process
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Topics: Finite element analysis, Manufacturing, Pins (Engineering), Press fits, Stress, Friction