1-20 of 20
Jimil M. Shah
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Accepted Manuscript
Article Type: Technical Briefs
J. Electron. Packag.
Paper No: EP-21-1070
Published Online: December 24, 2021
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
Published Online: October 14, 2021
Journal Articles
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
Published Online: September 15, 2021
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041103.
Paper No: EP-19-1096
Published Online: June 23, 2020
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2020, 142(2): 024501.
Paper No: EP-19-1015
Published Online: April 6, 2020
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 7–9, 2019
Paper No: IPACK2019-6587
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 7–9, 2019
Paper No: IPACK2019-6590
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 7–9, 2019
Paper No: IPACK2019-6600
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A016, October 7–9, 2019
Paper No: IPACK2019-6601
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 7–9, 2019
Paper No: IPACK2019-6602
Topics: Cooling
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011010.
Paper No: EP-18-1094
Published Online: November 8, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031003.
Paper No: EP-18-1103
Published Online: May 8, 2019
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021007.
Paper No: EP-18-1050
Published Online: April 10, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018
Paper No: IPACK2018-8432
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
Published Online: April 24, 2017
Proceedings Papers

Proc. ASME. IMECE2016, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T07A029, November 11–17, 2016
Paper No: IMECE2016-68127
Proceedings Papers

Proc. ASME. IMECE2016, Volume 12: Transportation Systems, V012T16A029, November 11–17, 2016
Paper No: IMECE2016-68128
Proceedings Papers

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A052, November 11–17, 2016
Paper No: IMECE2016-66199
Proceedings Papers

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A054, November 11–17, 2016
Paper No: IMECE2016-67320
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A015, July 6–9, 2015
Paper No: IPACK2015-48176