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J. W. Morris
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Proceedings Papers

Creep Behavior of PB-Free Solders

F. Hua, C. M. Garner, H. G. Song, J. W. Morris
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 219-229, November 11–16, 2001
Paper No: IMECE2001/EPP-24728
DOI: https://doi.org/10.1115/IMECE2001/EPP-24728
View Paper titled, Creep Behavior of PB-Free Solders
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Topics: Creep, Lead-free solders, Tin, Cooling, Solder joints, Stress, Diffusion (Physics), Solders, Furnaces, Intermetallic compounds
Journal Articles

Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

Z. Mei, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 104–108.
DOI: https://doi.org/10.1115/1.2906404
Published Online: June 1, 1992
View Article titled, Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates
Click here to open pdf in another window PDF for Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates
Topics: Cooling, Fatigue, Solder joints, Furnaces, Grain size, Quenching (Metalworking), Shear (Mechanics), Solidification
Journal Articles

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Z. Mei, J. W. Morris, Jr., M. C. Shine
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 109–114.
DOI: https://doi.org/10.1115/1.2905375
Published Online: June 1, 1991
View Article titled, Superplastic Creep of Eutectic Tin-Lead Solder Joints
Click here to open pdf in another window PDF for Superplastic Creep of Eutectic Tin-Lead Solder Joints
Topics: Creep, Solder joints, Superplasticity, Stress, Cooling, Dislocations, Grain boundaries, Nitrogen, Recrystallization, Steady state
Journal Articles

Creep in Shear of Experimental Solder Joints

D. Tribula, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 87–93.
DOI: https://doi.org/10.1115/1.2904363
Published Online: June 1, 1990
View Article titled, Creep in Shear of Experimental Solder Joints
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Topics: Creep, Shear (Mechanics), Solder joints, Fatigue, Temperature, Fatigue failure, Solders, Tin, Alloys, Electronics
Journal Articles

Isothermal Fatigue Behavior of Sn-Pb Solder Joints

T. S. E. Summers, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 94–99.
DOI: https://doi.org/10.1115/1.2904364
Published Online: June 1, 1990
View Article titled, Isothermal Fatigue Behavior of Sn-Pb Solder Joints
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Topics: Fatigue, Solder joints, Tin, Solders, Fatigue life, Copper, Displacement, Failure mechanisms, Shear (Mechanics), Stress
Journal Articles

Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints

D. Tribula, D. Grivas, D. R. Frear, J. W. Morris, Jr.
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 83–89.
DOI: https://doi.org/10.1115/1.3226526
Published Online: June 1, 1989
View Article titled, Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints
Click here to open pdf in another window PDF for Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints
Topics: Fatigue, Solder joints, Tin, Shear (Mechanics), Creep, Recrystallization, Solders, Deformation, Failure, Fatigue cracks
Journal Articles

Computer Simulation of Plastic Deformation Through Planar Glide in an Idealized Crystal

S. Altintas, K. Hanson, J. W. Morris, Jr.
Journal: Journal of Engineering Materials and Technology
Article Type: Research Papers
J. Eng. Mater. Technol. January 1976, 98(1): 86–91.
DOI: https://doi.org/10.1115/1.3443341
Published Online: January 1, 1976
View Article titled, Computer Simulation of Plastic Deformation Through Planar Glide in an Idealized Crystal
Click here to open pdf in another window PDF for Computer Simulation of Plastic Deformation Through Planar Glide in an Idealized Crystal
Topics: Computer simulation, Crystals, Deformation, Dislocations, Density, Stress, Temperature, Tension