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J. E. Beraun
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Proceedings Papers

Interfacial Phase Growth in Metal Matrix Composites

J. K. Chen, J. E. Beraun, D. Y. Tzou
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 97-102, November 15–20, 1998
Paper No: IMECE1998-0694
DOI: https://doi.org/10.1115/IMECE1998-0694
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Topics: Metal matrix composites, Diffusion (Physics), Chemical reactions, Modeling
Proceedings Papers

A Dual-Phase-Lag Diffusion Model for Predicting Thin Film Growth

J. K. Chen, J. E. Beraun, D. Y. Tzou
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 155-161, November 14–19, 1999
Paper No: IMECE1999-0928
DOI: https://doi.org/10.1115/IMECE1999-0928
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Topics: Diffusion (Physics), Thin films, Density, Model validation, Oxidation, Silicon
Proceedings Papers

Ultrafast Deformation in Femtosecond Laser Heating

D. Y. Tzou, J. E. Beraun, J. K. Chen
Proc. ASME. IMECE2001, Heat Transfer: Volume 4 — Combustion and Energy Systems, 337-345, November 11–16, 2001
Paper No: IMECE2001/HTD-24274
DOI: https://doi.org/10.1115/IMECE2001/HTD-24274
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Topics: Deformation, Heating, Lasers, Electrons, Metals, Temperature, Blasting, Elastic moduli, Electron-phonon interactions, Equations of motion
Proceedings Papers

Cluster Dynamics for Multiscale Interactions

D. Y. Tzou, J. K. Chen, R. Roybal, J. E. Beraun
Proc. ASME. HT2003, Heat Transfer: Volume 1, 609-616, July 21–23, 2003
Paper No: HT2003-47560
DOI: https://doi.org/10.1115/HT2003-47560
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Topics: Dynamics (Mechanics), Heat, Shapes, Dimensions, Lennard-Jones potential, Microscale devices, Simulation
Journal Articles

Ultrafast Deformation in Femtosecond Laser Heating

D. Y. Tzou, James C. Dowell Professor, Fellow ASME, J. E. Beraun, J. K. Chen
Journal: Journal of Heat Transfer
Article Type: Technical Papers
J. Heat Transfer. April 2002, 124(2): 284–292.
DOI: https://doi.org/10.1115/1.1447934
Published Online: September 4, 2001
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Topics: Deformation, Electrons, Heating, Lasers, Metals, Phonons, Temperature, Transients (Dynamics), Equilibrium (Physics), Electron-phonon interactions
Journal Articles

A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

J. K. Chen, J. E. Beraun, D. Y. Tzou
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 52–57.
DOI: https://doi.org/10.1115/1.1326438
Published Online: June 27, 2000
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Topics: Diffusion (Physics), Intermetallic compounds, Solder joints, Chemical reactions