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Journal Articles

Experimental and Computational Study of Error and Uncertainty in Real-Time Camera-Based Tracking of a Two-Dimensional Marker for Orthopedic Surgical Navigation

Guangyu He, Amin Fakhari, Fazel Khan, Imin Kao
Journal: Journal of Verification, Validation and Uncertainty Quantification
Publisher: ASME
Article Type: Research-Article
J. Verif. Valid. Uncert. June 2023, 8(2): 021001.
Paper No: VVUQ-22-1013
https://doi.org/10.1115/1.4062137
Published Online: May 4, 2023
View Article titled, Experimental and Computational Study of Error and Uncertainty in Real-Time Camera-Based Tracking of a Two-Dimensional Marker for Orthopedic Surgical Navigation
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Topics: Errors, Printing, Uncertainty, Simulation, Corners (Structural elements)
Journal Articles

Impedance Control on Redundant Manipulators With Zero-Potential-Energy Motions: Theory and Experimental Validation

Carlos Saldarriaga, Imin Kao
Journal: Journal of Mechanisms and Robotics
Publisher: ASME
Article Type: Research Papers
J. Mechanisms Robotics. October 2023, 15(5): 051010.
Paper No: JMR-22-1144
https://doi.org/10.1115/1.4055966
Published Online: November 25, 2022
View Article titled, Impedance Control on Redundant Manipulators With Zero-Potential-Energy Motions: Theory and Experimental Validation
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Topics: Equilibrium (Physics), Robots, Steady state, Damping, Dynamic response, Redundant manipulators, Stiffness, Displacement
Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1121
https://doi.org/10.1115/IMECE1997-1121
View Paper titled, Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Proceedings Papers

Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining

Milind Bhagavat, Fuqian Yang, Imin Kao
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 819-824, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1097
https://doi.org/10.1115/IMECE1998-1097
View Paper titled, Elasto-Plastic Finite Element Analysis of Indentations in Free Abrasive Machining
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Topics: Abrasive machining, Finite element analysis, Abrasives, Finite element methods, Fracture (Process), Sawing, Semiconductor wafers, Shapes, Slurries, Stress analysis (Engineering)
Proceedings Papers

Analysis of Stiffness Control and Vibration of Wire in Wiresaw Manufacturing Process

Songbin Wei, Imin Kao
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 813-818, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1096
https://doi.org/10.1115/IMECE1998-1096
View Paper titled, Analysis of Stiffness Control and Vibration of Wire in Wiresaw Manufacturing Process
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Topics: Manufacturing, Stiffness, Vibration, Wire, Geometry, Modeling, Excitation, Numerical analysis, Tension, Vibration analysis
Proceedings Papers

Challenges in Slicing Large Diameter Silicon Wafers Using Slurry Wiresaw

Mohan Chandra, Philippe Leyvraz, Jon A. Talbott, Kedar P. Gupta, Imin Kao, Vish Prasad
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 807-811, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1095
https://doi.org/10.1115/IMECE1998-1095
View Paper titled, Challenges in Slicing Large Diameter Silicon Wafers Using Slurry Wiresaw
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Topics: Semiconductor wafers, Slurries, Cutting, Wire, Silicon, Finishes, Particulate matter
Proceedings Papers

High-Resolution Wafer Surface Topology Measurement Using Phase-Shifting Shadow Moiré Technique

Songbin Wei, E. Guan, Imin Kao, Fu-Pen Chiang
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 15-20, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0912
https://doi.org/10.1115/IMECE1999-0912
View Paper titled, High-Resolution Wafer Surface Topology Measurement Using Phase-Shifting Shadow Moiré Technique
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Topics: Resolution (Optics), Semiconductor wafers, Shades and shadows, Topology, Diffraction gratings, Diffraction patterns, Interpolation, Algorithms, Calibration, Diffraction
Proceedings Papers

Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw

Milind Bhagavat, Imin Kao
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 21-30, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0913
https://doi.org/10.1115/IMECE1999-0913
View Paper titled, Computational Model for Free Abrasive Machining of Brittle Silicon Using a Wiresaw
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Topics: Abrasive machining, Brittleness, Computer simulation, Silicon, Abrasives, Cutting, Finite element analysis, Fracture (Materials), Abrasion, Machining
Proceedings Papers

Interaction Between Wire and Ingot in Wiresaw Slicing

Fuqian Yang, J. C. M. Li, Imin Kao
Proc. ASME. IMECE99, Electronics Manufacturing Issues, 3-8, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0910
https://doi.org/10.1115/IMECE1999-0910
View Paper titled, Interaction Between Wire and Ingot in Wiresaw Slicing
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Topics: Wire, Deformation, Stiffness, Friction, Tension, Cutting, Displacement, Finite element analysis, Pressure
Proceedings Papers

Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw

Liqun Zhu, Imin Kao
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 123-128, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24715
https://doi.org/10.1115/IMECE2001/EPP-24715
View Paper titled, Equilibrium Elasto-Hydrodynamic Analysis in Wafer Slicing Process Using Wiresaw
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Topics: Equilibrium (Physics), Semiconductor wafers, Wire, Simulation results
Proceedings Papers

Teaching MEMS to Mechanical Engineering Students: A Paradigm Shift From Macro to Micro World

Imin Kao
Proc. ASME. IMECE2001, Mechanical Engineering Design Education: Issues and Case Studies, 61-66, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-23289
https://doi.org/10.1115/IMECE2001/DE-23289
View Paper titled, Teaching MEMS to Mechanical Engineering Students: A Paradigm Shift From Macro to Micro World
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Topics: Mechanical engineering, Microelectromechanical systems, Students, Teaching, Engineering students, Design, Electrochemistry, Manufacturing, Physics, Scaling laws (Mathematical physics)
Proceedings Papers

Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes

Songbin Wei, Imin Kao
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 213-219, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2266
https://doi.org/10.1115/IMECE2000-2266
View Paper titled, Free Vibration Analysis for Thin Wire of Modern Wiresaw Between Sliced Wafers in Wafer Manufacturing Processes
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Topics: Free vibrations, Manufacturing, Semiconductor wafers, Wire, Vibration, Excitation, Equations of motion, Impulse (Physics), Momentum, Simulation
Proceedings Papers

Analysis of the Interaction Between Thin-Film Fluid Hydrodynamics and Wire Vibration in Wafer Manufacturing Using Wiresaw

Liqun Zhu, Milind Bhagavat, Imin Kao
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 233-241, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2269
https://doi.org/10.1115/IMECE2000-2269
View Paper titled, Analysis of the Interaction Between Thin-Film Fluid Hydrodynamics and Wire Vibration in Wafer Manufacturing Using Wiresaw
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Topics: Fluids, Hydrodynamics, Manufacturing, Semiconductor wafers, Thin films, Vibration, Wire, Slurries, Pressure, Computer simulation
Journal Articles

Damped Vibration Response of An Axially Moving Wire Subject to An Oscillating Boundary Condition and the Application to Slurry Wiresaws

Liming Li, Imin Kao
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Research Papers
J. Vib. Acoust. October 2021, 143(5): 051002.
Paper No: VIB-20-1302
https://doi.org/10.1115/1.4049269
Published Online: January 13, 2021
View Article titled, Damped Vibration Response of An Axially Moving Wire Subject to An Oscillating Boundary Condition and the Application to Slurry Wiresaws
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Topics: Oscillations, Vibration, Wire, Boundary-value problems, Traveling waves, Damping
Journal Articles

Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition

Liming Li, Imin Kao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. May 2021, 143(5): 051006.
Paper No: MANU-20-1189
https://doi.org/10.1115/1.4048637
Published Online: November 11, 2020
View Article titled, Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition
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Topics: Oscillations, Vibration, Wire, Semiconductor wafers, Slurries, Abrasive machining, Boundary-value problems
Proceedings Papers

Modeling and Experimental Study of the Impact on Free Abrasive Machining (FAM) due to Vibration of a Thin Wire Subject to an Oscillating Boundary Condition

Liming Li, Imin Kao
Proc. ASME. MSEC2019, Volume 2: Processes; Materials, V002T03A026, June 10–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2019-2754
https://doi.org/10.1115/MSEC2019-2754
View Paper titled, Modeling and Experimental Study of the Impact on Free Abrasive Machining (FAM) due to Vibration of a Thin Wire Subject to an Oscillating Boundary Condition
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Topics: Abrasive machining, Boundary-value problems, Modeling, Vibration, Wire, Silicon, Damping, Slurries, Excitation, Fracture (Materials)
Journal Articles

Assessment of Workspace Attributes Under Simulated Index Finger Proximal Interphalangeal Arthrodesis

Paul G. Arauz, Sue A. Sisto, Imin Kao
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Research-Article
J Biomech Eng. May 2016, 138(5): 051005.
Paper No: BIO-15-1506
https://doi.org/10.1115/1.4032967
Published Online: March 25, 2016
View Article titled, Assessment of Workspace Attributes Under Simulated Index Finger Proximal Interphalangeal Arthrodesis
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Topics: Design, Kinematics
Proceedings Papers

Study on the Vibration Response of Axially Moving Continua

Chunhui Chung, Imin Kao
Proc. ASME. DSCC2013, Volume 2: Control, Monitoring, and Energy Harvesting of Vibratory Systems; Cooperative and Networked Control; Delay Systems; Dynamical Modeling and Diagnostics in Biomedical Systems; Estimation and Id of Energy Systems; Fault Detection; Flow and Thermal Systems; Haptics and Hand Motion; Human Assistive Systems and Wearable Robots; Instrumentation and Characterization in Bio-Systems; Intelligent Transportation Systems; Linear Systems and Robust Control; Marine Vehicles; Nonholonomic Systems, V002T18A001, October 21–23, 2013
Publisher: American Society of Mechanical Engineers
Paper No: DSCC2013-3811
https://doi.org/10.1115/DSCC2013-3811
View Paper titled, Study on the Vibration Response of Axially Moving Continua
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Topics: Vibration, Belts, Chain, Equations of motion, Laplace transforms, Machinery, Modal analysis, Transfer functions, Transmission parts, Wave propagation
Journal Articles

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

Chunhui Chung, Chad S. Korach, Imin Kao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2011, 133(3): 031006.
https://doi.org/10.1115/1.4004137
Published Online: June 8, 2011
View Article titled, Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes
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Topics: Grinding, Surface roughness, Abrasives, Slurries, Semiconductor wafers, Particulate matter, Modeling
Proceedings Papers

Experimental Study of Lapping Using Mixed Abrasive Grits

Chunhui Chung, Glenn Melendez, Imin Kao
Proc. ASME. MSEC2009, ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1, 729-736, October 4–7, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2009-84210
https://doi.org/10.1115/MSEC2009-84210
View Paper titled, Experimental Study of Lapping Using Mixed Abrasive Grits
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Topics: Grinding, Semiconductor wafers, Manufacturing, Slurries, Surface roughness, Microelectronic devices, Abrasive machining, Abrasives, Brittleness, Density