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Proceedings Papers

System Design and Implementation of a Transient-Motion-Powered IoT Sensor Node

Xin Li, Hong Tang, Junrui Liang
Proc. ASME. SMASIS2020, ASME 2020 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, V001T07A006, September 15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: SMASIS2020-2446
https://doi.org/10.1115/SMASIS2020-2446
View Paper titled, System Design and Implementation of a Transient-Motion-Powered IoT Sensor Node
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Topics: Design, Internet of things, Sensors, Transients (Dynamics)
Proceedings Papers

Effect of Head Posture on Airflow and Pressure Behavior of Human Upper Airway During Snoring

Junshi Wang, Pan Han, Ruixuan Tang, Hong Tang, Younghoon Kwon, Jinxiang Xi, Haibo Dong
Proc. ASME. FEDSM2020, Volume 2: Fluid Mechanics; Multiphase Flows, V002T03A019, July 13–15, 2020
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM2020-20386
https://doi.org/10.1115/FEDSM2020-20386
View Paper titled, Effect of Head Posture on Airflow and Pressure Behavior of Human Upper Airway During Snoring
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Topics: Air flow, Computer simulation, Dynamics (Mechanics), Pressure, Vortices
Proceedings Papers

Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging

Cemal Basaran, Hong Tang
Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 61-68, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32874
https://doi.org/10.1115/IMECE2002-32874
View Paper titled, Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging
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Topics: Damage mechanics, Microelectronic packaging, Solders, Damage, Ball-Grid-Array packaging, Thermomechanics, Alloys, Constitutive equations, Engineering simulation, Fatigue
Proceedings Papers

Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading

Cemal Basaran, Hong Tang, Shihua Nie
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 229-236, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32849
https://doi.org/10.1115/IMECE2002-32849
View Paper titled, Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading
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Topics: Damage mechanics, Fatigue, Solder joints, Damage, Stress, Ball-Grid-Array packaging, Elastic moduli, Fatigue damage, Fatigue life, Materials degradation
Journal Articles

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

Hong Tang, Cemal Basaran, Mem. ASME, Associate Professor and Director,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 120–125.
https://doi.org/10.1115/1.1536171
Published Online: March 14, 2003
View Article titled, A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints
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Topics: Cycles, Damage, Fatigue life, Finite element analysis, Simulation, Solder joints, Solders, Constitutive equations, Fatigue, Ball-Grid-Array packaging