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Harry E. Stephanou
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Proceedings Papers

Die and Wafer-Level Hermetic Sealing for MEMS Applications

Abiodun A. Fasoro, Praveen Pandojirao-S., Dan O. Popa, Harry E. Stephanou, Dereje A. Agonafer
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 67-72, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33850
https://doi.org/10.1115/IPACK2007-33850
View Paper titled, Die and Wafer-Level Hermetic Sealing for MEMS Applications
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Topics: Microelectromechanical systems, Packaging, Reliability, Sealing (Process), Semiconductor wafers
Proceedings Papers

BCB Wafer Bonding Compatible With Bulk Micro Machining

Tao-Joo Hwang, Dan O. Popa, Jian-Qiang Lu, Byoung-Hun Kang, Harry E. Stephanou
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 93-99, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35011
https://doi.org/10.1115/IPACK2003-35011
View Paper titled, BCB Wafer Bonding Compatible With Bulk Micro Machining
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Topics: Bonding, Microfluidics, Micromachining, Polymers, Semiconductor wafers
Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041003.
https://doi.org/10.1115/1.2993142
Published Online: November 17, 2008
View Article titled, Design for Reliability Applied to Packaging of a MOEMS Switch
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Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders
Proceedings Papers

Design, Optimization, and Experiments of Compliant Microgripper

Young Seok Oh, Woo Ho Lee, Harry E. Stephanou, George D. Skidmore
Proc. ASME. IMECE2003, Microelectromechanical Systems, 345-350, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-55013
https://doi.org/10.1115/IMECE2003-55013
View Paper titled, Design, Optimization, and Experiments of Compliant Microgripper
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Topics: Design, Optimization, Finite element analysis, Grippers, Manufacturing, Microassembling, Silicon-on-insulator, Snap fitting, Actuators, Mass production
Proceedings Papers

Polymer Tube Embedded In-Plane Micropump: Design, Analysis and Fabrication

Ashutosh Kole, Jeongsik Sin, Woo Ho Lee, Danq Popaq, Dereje Agonafer, Harry E. Stephanou
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 407-413, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-83172
https://doi.org/10.1115/IMECE2005-83172
View Paper titled, Polymer Tube Embedded In-Plane Micropump: Design, Analysis and Fabrication
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Topics: Actuators, Design, Manufacturing, Micropumps, Polymers