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Gyoko Nagayama
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Journal Articles

Boundary Slip-Induced Temperature Rise and Film Thickness Reduction Under Sliding/Rolling Contact in Thermal Elastohydrodynamic Lubrication

Xianghua Meng, Jing Wang, Gyoko Nagayama
Journal: Journal of Tribology
Article Type: Research Papers
J. Tribol. July 2022, 144(7): 071602.
Paper No: TRIB-21-1436
DOI: https://doi.org/10.1115/1.4053180
Published Online: January 13, 2022
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Topics: Elastohydrodynamic lubrication, Film thickness, Lubricants, Lubrication, Temperature, Solids, Computer simulation
Proceedings Papers

Effect of Micro-Structured Surface on Dropwise Condensation Heat Transfer

Atsushi Tokunaga, Masaki Mizutani, Gyoko Nagayama, Takaharu Tsuruta
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A012, June 16–19, 2013
Paper No: ICNMM2013-73200
DOI: https://doi.org/10.1115/ICNMM2013-73200
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Topics: Condensation, Heat transfer, Drops, Heat transfer coefficients, Microelectromechanical systems, Floods, Condensed matter, Design, Drainage, Heat flux
Proceedings Papers

A Study on Inverted Temperature Profile Based on Nonequilibrium Molecular Dynamics Simulation

Atsushi Tokunaga, Gyoko Nagayama, Takaharu Tsuruta
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 901-907, August 8–13, 2010
Paper No: IHTC14-22801
DOI: https://doi.org/10.1115/IHTC14-22801
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Topics: Molecular dynamics simulation, Temperature profiles, Condensation, Temperature, Evaporation, Heat, Kinetic theory, Mass transfer, Molecular dynamics, Nonequilibrium thermodynamics
Proceedings Papers

Enhancement of Condensation Heat Transfer in Micro Systems

Atsushi Tokunaga, Gyoko Nagayama, Takaharu Tsuruta
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 599-605, July 19–23, 2009
Paper No: InterPACK2009-89234
DOI: https://doi.org/10.1115/InterPACK2009-89234
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Topics: Condensation, Heat transfer, Microelectromechanical systems, Thermal management, Computers, Condensers (steam plant), Cooling, Cooling systems, Electronic components, Electronics
Proceedings Papers

Microscopic Wetting at Nanostructured Surface: A Molecular Dynamics Study

Gyoko Nagayama, Kosuke Yanai, Kei Kurokawa, Takaharu Tsuruta
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 615-621, December 18–21, 2009
Paper No: MNHMT2009-18447
DOI: https://doi.org/10.1115/MNHMT2009-18447
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Topics: Molecular dynamics, Wetting, Nanostructures , Engineering simulation, Molecular dynamics simulation, Nanoscale phenomena, Shapes, Simulation, Vapors
Proceedings Papers

Microscopic Wetting at Microstructured Surface of Porous Silicon

Gyoko Nagayama, Ryuji Ando, Takaharu Tsuruta
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 623-628, December 18–21, 2009
Paper No: MNHMT2009-18452
DOI: https://doi.org/10.1115/MNHMT2009-18452
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Topics: Silicon, Wetting, Etching, Drops, Water, Coating processes, Coatings, Manufacturing, Molecular dynamics simulation, Nanoscale phenomena
Proceedings Papers

Fabrication of Macroporous on No-Mask Silicon Substrate for Application to Microsystems

Gyoko Nagayama, Ryuji Ando, Kei Muramatsu, Takaharu Tsuruta
Proc. ASME. MICRONANO2008, 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems, 725-726, June 3–5, 2008
Paper No: MicroNano2008-70323
DOI: https://doi.org/10.1115/MicroNano2008-70323
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Topics: Etching, Manufacturing, Micro fuel cells, Microelectromechanical systems, Porosity, Silicon
Proceedings Papers

Molecular Dynamics Simulations of Interfacial Heat and Mass Transfer at Nanostructured Surface

Gyoko Nagayama, Masako Kawagoe, Takaharu Tsuruta
Proc. ASME. MNC2007, First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 871-880, January 10–13, 2007
Paper No: MNC2007-21410
DOI: https://doi.org/10.1115/MNC2007-21410
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Topics: Heat, Mass transfer, Molecular dynamics simulation, Thermal resistance