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Guanghua Wu
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Proceedings Papers

Underwater Absorption Performance of a New Rubber-Based Acoustic Absorber Embedded With Composite Scatter

Guanghua Wu, Wei Han, Tianyun Li, Xiang Zhu
Proc. ASME. OMAE2024, Volume 5B: Ocean Engineering, V05BT06A049, June 9–14, 2024
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2024-124909
https://doi.org/10.1115/OMAE2024-124909
View Paper titled, Underwater Absorption Performance of a New Rubber-Based Acoustic Absorber Embedded With Composite Scatter
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Topics: Absorption, Acoustics, Composite materials, Electromagnetic scattering, Resonance, Rubber
Proceedings Papers

Thermal Design and Batch Fabrication of Cantilever Probes for Scanning Thermal Microscopy

Li Shi, Ohmyoung Kwon, Guanghua Wu, Arunava Majumdar
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 93-99, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0251
https://doi.org/10.1115/IMECE1999-0251
View Paper titled, Thermal Design and Batch Fabrication of Cantilever Probes for Scanning Thermal Microscopy
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Topics: Cantilevers, Design, Manufacturing, Microscopy, Probes, Semiconductor wafers, Heat transfer, Imaging, Junctions, Lasers
Proceedings Papers

Multiplexed Detection of Nanoscale Microcantilever Deflections for High-Throughput Biomolecular Analysis

Chris Dames, Guanghua Wu, Henry Lin, Aran Majumdar
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 123-130, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23818
https://doi.org/10.1115/IMECE2001/MEMS-23818
View Paper titled, Multiplexed Detection of Nanoscale Microcantilever Deflections for High-Throughput Biomolecular Analysis
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Topics: Deflection, Microcantilevers, Microelectromechanical systems, Nanoscale phenomena, Stress
Journal Articles

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Bo Tao, Guanghua Wu, Zhouping Yin, Youlun Xiong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041008.
Paper No: EP-12-1112
https://doi.org/10.1115/1.4025840
Published Online: November 12, 2013
View Article titled, A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions
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Topics: Shear strength