1-17 of 17
Gary L. Solbrekken
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Analysis of Using Ferrofluid as an Interface Material in a Field Reversible Thermal Connector

Ahmed S. Yousif, Gary L. Solbrekken
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021003.
Paper No: EP-14-1056
https://doi.org/10.1115/1.4028958
Published Online: June 1, 2015
View Article titled, Analysis of Using Ferrofluid as an Interface Material in a Field Reversible Thermal Connector
Open the PDF for Analysis of Using Ferrofluid as an Interface Material in a Field Reversible Thermal Connector in another window
Topics: Cooling, Design, Ferrofluids, Magnets, Thermal resistance
Proceedings Papers

Thermal-Mechanical Analysis of a Low-Enriched Uranium Foil Based Annular Target for the Production of Molybdenum-99

Srisharan G. Govindarajan, Gary L. Solbrekken, Charlie W. Allen
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2313-2322, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-86921
https://doi.org/10.1115/IMECE2012-86921
View Paper titled, Thermal-Mechanical Analysis of a Low-Enriched Uranium Foil Based Annular Target for the Production of Molybdenum-99
Open the PDF for Thermal-Mechanical Analysis of a Low-Enriched Uranium Foil Based Annular Target for the Production of Molybdenum-99 in another window
Topics: Molybdenum, Uranium, Aluminum tube, Finite element analysis, Heat, Irradiation (Radiation exposure), Safety, Cladding systems (Building), Computer simulation, Contact resistance
Proceedings Papers

Experimental Testing of Annular Target Surrogates for the Production of Molybdenum-99

Philip F. Makarewicz, Srisharan Garg Govindarajan, Gary L. Solbrekken
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2323-2331, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87783
https://doi.org/10.1115/IMECE2012-87783
View Paper titled, Experimental Testing of Annular Target Surrogates for the Production of Molybdenum-99
Open the PDF for Experimental Testing of Annular Target Surrogates for the Production of Molybdenum-99 in another window
Topics: Molybdenum, Testing, Irradiation (Radiation exposure), Uranium, Compression, Contact resistance, Cooling, Design, Heating, Imaging
Proceedings Papers

Microfabrication of Single-Cell Scale Sample Holder for Scanning Thermal Analysis

Logan M. Compton, James L. Armes, Gary L. Solbrekken
Proc. ASME. IMECE2012, Volume 2: Biomedical and Biotechnology, 639-648, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-86947
https://doi.org/10.1115/IMECE2012-86947
View Paper titled, Microfabrication of Single-Cell Scale Sample Holder for Scanning Thermal Analysis
Open the PDF for Microfabrication of Single-Cell Scale Sample Holder for Scanning Thermal Analysis in another window
Topics: Microfabrication, Thermal analysis, Cooling, Cryonics, Biological tissues, Calorimetry, Computer software, Heat capacity, Heating, Latent heat
Proceedings Papers

Custom 1-D CFD Numeric Model of Single-Cell Scale Sample Holder for Scanning Thermal Analysis

Logan M. Compton, James L. Armes, Gary L. Solbrekken
Proc. ASME. IMECE2012, Volume 2: Biomedical and Biotechnology, 403-412, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89615
https://doi.org/10.1115/IMECE2012-89615
View Paper titled, Custom 1-D CFD Numeric Model of Single-Cell Scale Sample Holder for Scanning Thermal Analysis
Open the PDF for Custom 1-D CFD Numeric Model of Single-Cell Scale Sample Holder for Scanning Thermal Analysis in another window
Topics: Computational fluid dynamics, Thermal analysis, Cooling, Electric current, Heat capacity, Latent heat, Absorption, Biological tissues, Bridges (Structures), Calorimetry
Proceedings Papers

Thermal-Mechanical Response of Non-Uniformly Heated Nominally Flat and Curved LEU Foil Based Target

Kyler K. Turner, Gary L. Solbrekken, Charlie W. Allen
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 2333-2340, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-88939
https://doi.org/10.1115/IMECE2012-88939
View Paper titled, Thermal-Mechanical Response of Non-Uniformly Heated Nominally Flat and Curved LEU Foil Based Target
Open the PDF for Thermal-Mechanical Response of Non-Uniformly Heated Nominally Flat and Curved LEU Foil Based Target in another window
Topics: Aluminum plate, Bonding, Clamps (Tools), Deflection, Deformation, Density, Design, Fuels, Heat transfer coefficients, Imaging
Proceedings Papers

Thermal-Mechanical Response of Non-Uniformly Heated LEU Foil Based Target

Kyler K. Turner, Gary L. Solbrekken, Charlie W. Allen
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 1263-1271, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64734
https://doi.org/10.1115/IMECE2011-64734
View Paper titled, Thermal-Mechanical Response of Non-Uniformly Heated LEU Foil Based Target
Open the PDF for Thermal-Mechanical Response of Non-Uniformly Heated LEU Foil Based Target in another window
Topics: Aluminum plate, Bonding, Clamps (Tools), Deflection, Deformation, Density, Design, Fuels, Geometry, Heat transfer coefficients
Proceedings Papers

Coupled Fluid Structure Interaction (FSI) Modeling of Parallel Plate Assemblies

John C. Kennedy, Gary L. Solbrekken
Proc. ASME. IMECE2011, Volume 4: Energy Systems Analysis, Thermodynamics and Sustainability; Combustion Science and Engineering; Nanoengineering for Energy, Parts A and B, 159-167, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64106
https://doi.org/10.1115/IMECE2011-64106
View Paper titled, Coupled Fluid Structure Interaction (FSI) Modeling of Parallel Plate Assemblies
Open the PDF for Coupled Fluid Structure Interaction (FSI) Modeling of Parallel Plate Assemblies in another window
Topics: Aluminum, Computational fluid dynamics, Coolants, Deflection, Deformation, Design, Diluents, Finite element methods, Finite element model, Flow (Dynamics)
Proceedings Papers

Thermal-Mechanical Analysis of Varying Boundary Conditions on a LEU Foil Based Molybdenum-99 Plate Processing Target

Kyler K. Turner, Gary L. Solbrekken, Charlie W. Allen
Proc. ASME. IMECE2010, Volume 9: Mechanics of Solids, Structures and Fluids, 445-451, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39393
https://doi.org/10.1115/IMECE2010-39393
View Paper titled, Thermal-Mechanical Analysis of Varying Boundary Conditions on a LEU Foil Based Molybdenum-99 Plate Processing Target
Open the PDF for Thermal-Mechanical Analysis of Varying Boundary Conditions on a LEU Foil Based Molybdenum-99 Plate Processing Target in another window
Topics: Boundary-value problems, Molybdenum, Aluminum plate, Design, Uranium, Clamps (Tools), Drugs, Fuels, Geometry, Imaging
Proceedings Papers

Thermal-Mechanical Analysis of Annular Target Design for High Volume Production of Molybdenum-99 Using Low-Enriched Uranium

Kyler K. Turner, Gary L. Solbrekken, Charlie W. Allen
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1283-1289, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-13238
https://doi.org/10.1115/IMECE2009-13238
View Paper titled, Thermal-Mechanical Analysis of Annular Target Design for High Volume Production of Molybdenum-99 Using Low-Enriched Uranium
Open the PDF for Thermal-Mechanical Analysis of Annular Target Design for High Volume Production of Molybdenum-99 Using Low-Enriched Uranium in another window
Topics: Design, Molybdenum, Uranium, Contact resistance, Heating, Isotopes, Testing, Biomedicine, Cladding systems (Building), Failure mechanisms
Proceedings Papers

Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures

Jesse VanEngelenhoven, Gary L. Solbrekken, Karl J. L. Geisler
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 801-809, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33641
https://doi.org/10.1115/IPACK2007-33641
View Paper titled, Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures
Open the PDF for Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures in another window
Topics: Cooling, Electronics, Heat, Ducts, Heat transfer, Manufacturing, Pressure drop, Air flow, Boundary-value problems, Energy dissipation
Proceedings Papers

Development of a Micro-Scale Differential Scanning Calorimeter for Single Cell Measurements

William G. Zhao, Gary L. Solbrekken, Steven F. Mullen, James D. Benson, Xu Han, John K. Critser
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 385-392, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32555
https://doi.org/10.1115/HT2007-32555
View Paper titled, Development of a Micro-Scale Differential Scanning Calorimeter for Single Cell Measurements
Open the PDF for Development of a Micro-Scale Differential Scanning Calorimeter for Single Cell Measurements in another window
Topics: Cryonics, Microscale devices, Temperature, Feedback, Cooling, Electric current, Electrodes, Engineering prototypes, Freezing, Heat
Proceedings Papers

An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment

Robert A. Taylor, Gary L. Solbrekken
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2139-2145, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73190
https://doi.org/10.1115/IPACK2005-73190
View Paper titled, An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment
Open the PDF for An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment in another window
Topics: Electronic equipment, Optimization, Refrigeration, Heat sinks, Temperature, Junctions, Cooling, Geometry, Electronics, Heat
Proceedings Papers

Thermoelectric Micro-Cooler for Hot-Spot Thermal Management

Peng Wang, Avram Bar-Cohen, Bao Yang, Gary L. Solbrekken, Yan Zhang, Ali Shakouri
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2161-2171, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73244
https://doi.org/10.1115/IPACK2005-73244
View Paper titled, Thermoelectric Micro-Cooler for Hot-Spot Thermal Management
Open the PDF for Thermoelectric Micro-Cooler for Hot-Spot Thermal Management in another window
Topics: Cooling, Microcoolers, Thermal management
Proceedings Papers

Peltier Enhanced Heat Spreading for Localized Hot Spot Thermal Management

Gary L. Solbrekken
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2199-2205, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73471
https://doi.org/10.1115/IPACK2005-73471
View Paper titled, Peltier Enhanced Heat Spreading for Localized Hot Spot Thermal Management
Open the PDF for Peltier Enhanced Heat Spreading for Localized Hot Spot Thermal Management in another window
Topics: Heat, Thermal management, Heat flux, Thermal conductivity, Thermoelectricity, Electrical resistivity, Heating, Junctions, Temperature, Temperature gradient
Proceedings Papers

Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices

Gary L. Solbrekken, Kazuaki Yazawa, Avram Bar-Cohen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 647-652, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35305
https://doi.org/10.1115/IPACK2003-35305
View Paper titled, Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices
Open the PDF for Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices in another window
Topics: Electronic equipment, Refrigeration, Thermoelectric devices, Heat sinks, Heat, Energy dissipation, Thermal resistance, Accounting, Electronic components, Flow (Dynamics)
Proceedings Papers

Thermofluid Design of Energy Efficient and Compact Heat Sinks

Kazuaki Yazawa, Gary L. Solbrekken, Avram Bar-Cohen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 509-516, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35242
https://doi.org/10.1115/IPACK2003-35242
View Paper titled, Thermofluid Design of Energy Efficient and Compact Heat Sinks
Open the PDF for Thermofluid Design of Energy Efficient and Compact Heat Sinks in another window
Topics: Design, Heat sinks, Thermofluids, Fins, Convection, Cooling, Cooling systems, Design methodology, Electronic products, Energy efficiency