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Proceedings Papers

Material Deterioration and Residual Life Evaluation of High Temperature Steam Pipeline

Zhifeng Li, Libin Song, Gang Chen
Proc. ASME. PVP2023, Volume 5: Materials & Fabrication, V005T06A020, July 16–21, 2023
Publisher: American Society of Mechanical Engineers
Paper No: PVP2023-106947
https://doi.org/10.1115/PVP2023-106947
View Paper titled, Material Deterioration and Residual Life Evaluation of High Temperature Steam Pipeline
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Topics: Creep, Fracture (Materials), High temperature steam, Pipelines, Mechanical properties, Pipes, Stress, Stress concentration, Emission spectroscopy, Molybdenum
Proceedings Papers

Study on Deformation Analysis and Prediction Method of Multi-Function FPSO Hull

Hongtao Yuan, Huilong Ren, Gang Chen, Yan Yin, Chao Wang, Bin Wu
Proc. ASME. OMAE2023, Volume 1: Offshore Technology, V001T01A029, June 11–16, 2023
Publisher: American Society of Mechanical Engineers
Paper No: OMAE2023-102830
https://doi.org/10.1115/OMAE2023-102830
View Paper titled, Study on Deformation Analysis and Prediction Method of Multi-Function FPSO Hull
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Topics: Deformation, Design, FPSO, Girders, Hull
Proceedings Papers

Computation of Supersonic Flow for Thin Film Deposition Using Expansion Through a Skimmer

Iain D. Boyd, Gang Chen
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 169-176, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1349
https://doi.org/10.1115/IMECE1996-1349
View Paper titled, Computation of Supersonic Flow for Thin Film Deposition Using Expansion Through a Skimmer
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Topics: Computation, Supersonic flow, Thin films, Simulation, Monte Carlo methods, Design, Flow (Dynamics), Gasdynamics, Hydrogen, Nonequilibrium flow
Proceedings Papers

A Physics-Driven X-Ray Image Data Augmentation Method for Automated Threat Detection in Nuclear Facility Entrancement

Shuo Xu, Gang Chen, Weiwei Li, Xincheng Xiang
Proc. ASME. ICONE29, Volume 5: Nuclear Safety, Security, and Cyber Security, V005T05A041, August 8–12, 2022
Publisher: American Society of Mechanical Engineers
Paper No: ICONE29-92402
https://doi.org/10.1115/ICONE29-92402
View Paper titled, A Physics-Driven X-Ray Image Data Augmentation Method for Automated Threat Detection in Nuclear Facility Entrancement
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Topics: Physics, X-rays
Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
https://doi.org/10.1115/1.4054821
Published Online: August 3, 2022
View Article titled, The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders
Proceedings Papers

Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement

Theodorian Borca Tasciuc, Gang Chen
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 297-303, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0855
https://doi.org/10.1115/IMECE1997-0855
View Paper titled, Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement
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Topics: Lasers, Microscopes, Thin films, Laser beams, Thermal diffusivity, Thermocouples, Waves, Bulk solids, Fittings, Glass
Proceedings Papers

Molecular Dynamics Simulation of Thermal Conductivity in Bulk Silicon and Nanowires

Sebastian G. Volz, Gang Chen
Proc. ASME. IMECE98, Heat Transfer: Volume 4 — Heat Transfer in Materials Processing, 199-208, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0706
https://doi.org/10.1115/IMECE1998-0706
View Paper titled, Molecular Dynamics Simulation of Thermal Conductivity in Bulk Silicon and Nanowires
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Topics: Molecular dynamics simulation, Nanowires, Silicon, Thermal conductivity, Phonons, Crystals, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Approximation
Proceedings Papers

Thermal Conductivity of Nano-Porous Bismuth Thin Films for Thermoelectric Applications

David W. Song, Wei-Ning Shen, Taofang Zeng, Weili Liu, Gang Chen, Bruce Dunn, Caroline D. Moore, Mark S. Goorsky, Tamara Radetic, Ronald Gronsky
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 345-349, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1003
https://doi.org/10.1115/IMECE1999-1003
View Paper titled, Thermal Conductivity of Nano-Porous Bismuth Thin Films for Thermoelectric Applications
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Topics: Thermal conductivity, Thin films, Temperature, Electrical conductivity, Electron transport, Metals, Phonons, Porosity, Porous materials
Proceedings Papers

Energy Conversion in Multilayer Thin-Film Structures for Thermionic Cooling

Taofang Zeng, Gang Chen
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 339-343, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1002
https://doi.org/10.1115/IMECE1999-1002
View Paper titled, Energy Conversion in Multilayer Thin-Film Structures for Thermionic Cooling
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Topics: Coolers, Cooling, Electrons, Energy budget (Physics), Energy conversion, Errors, Filters, Heat flux, Structural optimization, Thin films
Proceedings Papers

Temperature Dependent Thermal Conductivity of Symmetrically Strained Si/Ge Superlattices

Theodorian Borca-Tasciuc, Jianlin Liu, Taofang Zeng, Weili Liu, David W. Song, Caroline D. Moore, Gang Chen, Kang L. Wang, Mark S. Goorsky, Tamara Radetic, Ronald Gronsky
Proc. ASME. IMECE99, Heat Transfer: Volume 3, 117-122, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-1069
https://doi.org/10.1115/IMECE1999-1069
View Paper titled, Temperature Dependent Thermal Conductivity of Symmetrically Strained Si/Ge Superlattices
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Topics: Superlattices, Temperature, Thermal conductivity, Gallium arsenide, Molecular beam epitaxy, Alloys, Bulk solids, Chemical vapor deposition, Dislocation density, Metalorganic chemical vapor deposition
Proceedings Papers

Ballistic-Diffusive Equations for Transient Heat Conduction From Nano- to Macroscales

Gang Chen
Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 261-270, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24403
https://doi.org/10.1115/IMECE2001/HTD-24403
View Paper titled, Ballistic-Diffusive Equations for Transient Heat Conduction From Nano- to Macroscales
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Topics: Transient heat transfer, Boundary-value problems, Approximation, Heat conduction, Relaxation (Physics), Temperature, Thin films
Proceedings Papers

Two-Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations

Ronggui Yang, Gang Chen
Proc. ASME. IMECE2001, Heat Transfer: Volume 1 — Fundamentals of Heat Transfer, 363-366, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24141
https://doi.org/10.1115/IMECE2001/HTD-24141
View Paper titled, Two-Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations
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Topics: Heat conduction, Nanoscale phenomena, Relaxation (Physics), Approximation, Electromagnetic scattering, Heat, Phonons, Radiation scattering, Scattering (Physics), Size effect
Proceedings Papers

Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler

Da-Jeng Yao, Gang Chen, Chang-Jin “CJ” Kim
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 719-722, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/MEMS-23901
https://doi.org/10.1115/IMECE2001/MEMS-23901
View Paper titled, Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler
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Topics: Bonding, Low temperature, Microelectromechanical systems, Thermoelectric coolers, Cooling, Manufacturing, Microbeams, Silicon, Flow (Dynamics), High temperature
Proceedings Papers

Photonic and Radiative Properties of Bubble Arrays

Koji Miyazaki, Bao Yang, Arvind Narayanaswamy, Gang Chen
Proc. ASME. IMECE2001, Heat Transfer: Volume 1 — Fundamentals of Heat Transfer, 393-396, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/HTD-24148
https://doi.org/10.1115/IMECE2001/HTD-24148
View Paper titled, Photonic and Radiative Properties of Bubble Arrays
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Topics: Bubbles, Computer simulation, Density, Packing (Shipments), Packings (Cushioning), Reflectance
Journal Articles

Perspectives on Molecular-Level Understanding of Thermophysics of Liquids and Future Research Directions

Gang Chen
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Review Articles
J. Heat Mass Transfer. January 2022, 144(1): 010801.
Paper No: HT-21-1592
https://doi.org/10.1115/1.4052657
Published Online: November 9, 2021
View Article titled, Perspectives on Molecular-Level Understanding of Thermophysics of Liquids and Future Research Directions
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Topics: Phonons, Specific heat, Temperature, Thermal conductivity, Viscosity, Water, Molecular dynamics simulation
Proceedings Papers

Interplay Between Thermoelectric and Thermionic Effects in Heterostructures

Taofang Zeng, Gang Chen
Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 361-371, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1448
https://doi.org/10.1115/IMECE2000-1448
View Paper titled, Interplay Between Thermoelectric and Thermionic Effects in Heterostructures
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Topics: Electrons, Energy generation, Fermi level, Film thickness, Junctions, Mean free path, Phonons, Refrigeration, Temperature, Thermionic emission
Proceedings Papers

Anisotropic Thermal Conductivity of a Si/Ge Quantum Dot Superlattice

Theodorian Borca-Tasciuc, Weili Liu, Jianlin Liu, Kang L. Wang, Gang Chen
Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 381-384, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1450
https://doi.org/10.1115/IMECE2000-1450
View Paper titled, Anisotropic Thermal Conductivity of a Si/Ge Quantum Dot Superlattice
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Topics: Anisotropy, Quantum dots, Superlattices, Thermal conductivity, Heat, Molecular beam epitaxy, Self-organization, Temperature, Wire
Proceedings Papers

Web-It-Man: A Web-Based Integrated Tool for Manufacturing Environment

Ramesh K. Karne, Swati V. Dandekar, Sridhar Poluri, Gang Chen, John S. Baras, Dana S. Nau, Michael O. Ball, Edward Lin, Vinai S. Trichur, James T. Williams
Proc. ASME. DETC98, Volume 6: 18th Computers in Engineering Conference, V006T06A047, September 13–16, 1998
Publisher: American Society of Mechanical Engineers
Paper No: DETC98/CIE-5524
https://doi.org/10.1115/DETC98/CIE-5524
View Paper titled, Web-It-Man: A Web-Based Integrated Tool for Manufacturing Environment
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Topics: Manufacturing, Computer-aided design, Design, Engineering prototypes, Internet, Manufacturing tools, System architecture, User interfaces
Journal Articles

Investigation of Mechanical Integrity of Prismatic Lithium-Ion Batteries With Various State of Charge

Tao Wang, Xiaoping Chen, Gang Chen, Hongbo Ji, Ling Li, Quan Yuan, Yuezhuan Liu, Yingping Ji
Journal: Journal of Electrochemical Energy Conversion and Storage
Publisher: ASME
Article Type: Research Papers
J. Electrochem. En. Conv. Stor. August 2021, 18(3): 031002.
Paper No: JEECS-20-1032
https://doi.org/10.1115/1.4048330
Published Online: September 29, 2020
View Article titled, Investigation of Mechanical Integrity of Prismatic Lithium-Ion Batteries With Various State of Charge
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Topics: Compression, Lithium-ion batteries, Stress
Journal Articles

An Eddy-Viscosity Model Sensitized to Curvature and Wall-Roughness Effects for Reynolds-Averaged Closure

Yang Zhang, Gang Chen, Jiakuan Xu
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research-Article
J. Fluids Eng. April 2020, 142(4): 041503.
Paper No: FE-19-1361
https://doi.org/10.1115/1.4045611
Published Online: February 4, 2020
View Article titled, An Eddy-Viscosity Model Sensitized to Curvature and Wall-Roughness Effects for Reynolds-Averaged Closure
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Topics: Eddies (Fluid dynamics), Flow (Dynamics), Rotation, Surface roughness, Turbulence, Viscosity, Channel flow, Damping, Ducts