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Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 261-270, November 11–16, 2001

Paper No: IMECE2001/HTD-24403

DOI: https://doi.org/10.1115/IMECE2001/HTD-24403

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Topics: Transient heat transfer, Boundary-value problems, Approximation, Heat conduction, Relaxation (Physics), Temperature, Thin films

Proceedings Papers

Two-Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations

Ronggui Yang, Gang Chen

Proc. ASME. IMECE2001, Heat Transfer: Volume 1 — Fundamentals of Heat Transfer, 363-366, November 11–16, 2001

Paper No: IMECE2001/HTD-24141

DOI: https://doi.org/10.1115/IMECE2001/HTD-24141

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Topics: Heat conduction, Nanoscale phenomena, Relaxation (Physics), Approximation, Electromagnetic scattering, Heat, Phonons, Radiation scattering, Scattering (Physics), Size effect

Proceedings Papers

Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler

Da-Jeng Yao, Gang Chen, Chang-Jin “CJ” Kim

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 719-722, November 11–16, 2001

Paper No: IMECE2001/MEMS-23901

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23901

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Topics: Bonding, Low temperature, Microelectromechanical systems, Thermoelectric coolers, Cooling, Manufacturing, Microbeams, Silicon, Flow (Dynamics), High temperature

Proceedings Papers

Photonic and Radiative Properties of Bubble Arrays

Koji Miyazaki, Bao Yang, Arvind Narayanaswamy, Gang Chen

Proc. ASME. IMECE2001, Heat Transfer: Volume 1 — Fundamentals of Heat Transfer, 393-396, November 11–16, 2001

Paper No: IMECE2001/HTD-24148

DOI: https://doi.org/10.1115/IMECE2001/HTD-24148

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Topics: Bubbles, Computer simulation, Density, Packing (Shipments), Packings (Cushioning), Reflectance

Journal Articles

Perspectives on Molecular-Level Understanding of Thermophysics of Liquids and Future Research Directions

Gang Chen

J. Heat Transfer. January 2022, 144(1): 010801.

Paper No: HT-21-1592

DOI: https://doi.org/10.1115/1.4052657

Published Online: November 9, 2021

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Topics: Phonons, Specific heat, Temperature, Thermal conductivity, Viscosity, Water, Molecular dynamics simulation

Proceedings Papers

Interplay Between Thermoelectric and Thermionic Effects in Heterostructures

Taofang Zeng, Gang Chen

Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 361-371, November 5–10, 2000

Paper No: IMECE2000-1448

DOI: https://doi.org/10.1115/IMECE2000-1448

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Topics: Electrons, Energy generation, Fermi level, Film thickness, Junctions, Mean free path, Phonons, Refrigeration, Temperature, Thermionic emission

Proceedings Papers

Anisotropic Thermal Conductivity of a Si/Ge Quantum Dot Superlattice

Theodorian Borca-Tasciuc, Weili Liu, Jianlin Liu, Kang L. Wang, Gang Chen

Proc. ASME. IMECE2000, Heat Transfer: Volume 2, 381-384, November 5–10, 2000

Paper No: IMECE2000-1450

DOI: https://doi.org/10.1115/IMECE2000-1450

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Topics: Anisotropy, Quantum dots, Superlattices, Thermal conductivity, Heat, Molecular beam epitaxy, Self-organization, Temperature, Wire

Proceedings Papers

Web-It-Man: A Web-Based Integrated Tool for Manufacturing Environment

Ramesh K. Karne, Swati V. Dandekar, Sridhar Poluri, Gang Chen, John S. Baras, Dana S. Nau, Michael O. Ball, Edward Lin, Vinai S. Trichur, James T. Williams

Proc. ASME. DETC98, Volume 6: 18th Computers in Engineering Conference, V006T06A047, September 13–16, 1998

Paper No: DETC98/CIE-5524

DOI: https://doi.org/10.1115/DETC98/CIE-5524

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Topics: Manufacturing, Computer-aided design, Design, Engineering prototypes, Internet, Manufacturing tools, System architecture, User interfaces

Journal Articles

Investigation of Mechanical Integrity of Prismatic Lithium-Ion Batteries With Various State of Charge

Tao Wang, Xiaoping Chen, Gang Chen, Hongbo Ji, Ling Li, Quan Yuan, Yuezhuan Liu, Yingping Ji

J. Electrochem. En. Conv. Stor. August 2021, 18(3): 031002.

Paper No: JEECS-20-1032

DOI: https://doi.org/10.1115/1.4048330

Published Online: September 29, 2020

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Topics: Compression, Lithium-ion batteries, Stress

Journal Articles

An Eddy-Viscosity Model Sensitized to Curvature and Wall-Roughness Effects for Reynolds-Averaged Closure

Yang Zhang, Gang Chen, Jiakuan Xu

J. Fluids Eng. April 2020, 142(4): 041503.

Paper No: FE-19-1361

DOI: https://doi.org/10.1115/1.4045611

Published Online: February 4, 2020

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Topics: Eddies (Fluid dynamics), Flow (Dynamics), Rotation, Surface roughness, Turbulence, Viscosity, Channel flow, Damping, Ducts

Proceedings Papers

Induced Draft Fan Early Anomaly Identification Based on SIS Data Using Normal Behavior Model in Thermal Power Plant

Di Hu, Sheng Guo, Gang Chen, Cheng Zhang, Dongzhen Lv, Bing Li, Qianming Chen

Proc. ASME. POWER2019, ASME 2019 Power Conference, V001T08A002, July 15–18, 2019

Paper No: POWER2019-1864

DOI: https://doi.org/10.1115/POWER2019-1864

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Topics: Thermal power stations, Condition monitoring, Artificial neural networks, China, Matlab, Power stations

Journal Articles

Study on the Expansion Force of TWIP Steel Expandable Tubular in Solid Expandable Tubular Technology

Shengkun Wang, Shengjun Huang, Minglei Wang, Gang Chen

J. Pressure Vessel Technol. April 2020, 142(2): 021501.

Paper No: PVT-19-1014

DOI: https://doi.org/10.1115/1.4044342

Published Online: November 27, 2019

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Topics: Equilibrium (Physics), Hardening, Steel, Stress, Friction, Finite element analysis, Finite element methods, Finite element model

Journal Articles

Formation Mechanisms of Exit-Chippings in Rotary Ultrasonic Drilling and Conventional Drilling of Glass BK7

Dongxi Lv, Dong Liu, Gang Chen, Leilei Song, Chun Yan, Xiaofei Wu, Yingdan Zhu

J. Manuf. Sci. Eng. January 2020, 142(1): 011004.

Paper No: MANU-19-1214

DOI: https://doi.org/10.1115/1.4045416

Published Online: November 20, 2019

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Topics: Drilling, Fracture (Materials), Vibration, Glass, Extruding

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Journal citation

NARROW

A Physics-Driven X-Ray Image Data Augmentation Method for Automated Threat Detection in Nuclear Facility Entrancement

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement

Molecular Dynamics Simulation of Thermal Conductivity in Bulk Silicon and Nanowires

Thermal Conductivity of Nano-Porous Bismuth Thin Films for Thermoelectric Applications

Energy Conversion in Multilayer Thin-Film Structures for Thermionic Cooling

Temperature Dependent Thermal Conductivity of Symmetrically Strained Si/Ge Superlattices

Ballistic-Diffusive Equations for Transient Heat Conduction From Nano- to Macroscales

Two-Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations

Low Temperature Eutectic Bonding for In-Plane Type Micro Thermoelectric Cooler

Photonic and Radiative Properties of Bubble Arrays

Perspectives on Molecular-Level Understanding of Thermophysics of Liquids and Future Research Directions

Interplay Between Thermoelectric and Thermionic Effects in Heterostructures

Anisotropic Thermal Conductivity of a Si/Ge Quantum Dot Superlattice

Web-It-Man: A Web-Based Integrated Tool for Manufacturing Environment

Investigation of Mechanical Integrity of Prismatic Lithium-Ion Batteries With Various State of Charge

An Eddy-Viscosity Model Sensitized to Curvature and Wall-Roughness Effects for Reynolds-Averaged Closure

Induced Draft Fan Early Anomaly Identification Based on SIS Data Using Normal Behavior Model in Thermal Power Plant

Study on the Expansion Force of TWIP Steel Expandable Tubular in Solid Expandable Tubular Technology

Formation Mechanisms of Exit-Chippings in Rotary Ultrasonic Drilling and Conventional Drilling of Glass BK7

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