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Gamal Refai-Ahmed
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Proceedings Papers

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97338
https://doi.org/10.1115/IPACK2022-97338
View Paper titled, Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation
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Topics: Computer simulation, Electrodiffusion, Physics
Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021007.
Paper No: EP-19-1111
https://doi.org/10.1115/1.4048590
Published Online: October 30, 2020
View Article titled, Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
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Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux
Proceedings Papers

Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications

Suresh Parameswaran, Gamal Refai-Ahmed, Suresh Ramalingam, Boon Ang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8300
https://doi.org/10.1115/IPACK2018-8300
View Paper titled, Next Gen Test-Vehicle to Simulate Thermal Load for IoT FPGA Applications
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Topics: Internet of things, Stress, Vehicles, Circuits, Computer software, Cooling, Cycles, Energy dissipation, Flip-chip packages, Modeling
Journal Articles

Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041006.
Paper No: EP-12-1106
https://doi.org/10.1115/1.4025531
Published Online: November 5, 2013
View Article titled, Solving Thermal Issues in a Three-Dimensional-Stacked-Quad-Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through-Silicon-Vias
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Topics: Cooling, Flow (Dynamics), Heat sinks, Microchannels, Temperature
Journal Articles

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Maxat N. Touzelbaev, Josef Miler, Yizhang Yang, Gamal Refai-Ahmed, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031001.
Paper No: EP-12-1066
https://doi.org/10.1115/1.4024747
Published Online: July 24, 2013
View Article titled, High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices
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Topics: Filters, Modeling, Temperature, Thermal management, Transfer functions, Transients (Dynamics), Geometry, Filtration
Proceedings Papers

Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 927-940, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65866
https://doi.org/10.1115/IMECE2011-65866
View Paper titled, Liquid Cooling of a Stacked Quad-Core Processor and DRAM Using Laminar Flow in Microchannels
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Topics: Cooling, Laminar flow, Microchannels, Flow (Dynamics), Heat sinks, Thermal resistance, Delays, Design, Energy dissipation, Reliability
Proceedings Papers

Thermal-Aware Power Migration in Many-Core Processors

Avinash Raghu, Saket Karajgikar, Dereje Agonafer, Bahgat Sammakia, Gamal Refai-Ahmed
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 385-392, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40232
https://doi.org/10.1115/IMECE2010-40232
View Paper titled, Thermal-Aware Power Migration in Many-Core Processors
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Topics: Computation, Cooling, Currents, Design, Junctions, Leakage, Reliability, Temperature, Thermal management
Proceedings Papers

Fast Prediction of Temperature Evolution in Electronic Devices for Run-Time Thermal Management Applications

Yizhang Yang, Sridhar Sundaram, Gamal Refai-Ahmed, Maxat Touzelbaev
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 245-251, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40462
https://doi.org/10.1115/IMECE2010-40462
View Paper titled, Fast Prediction of Temperature Evolution in Electronic Devices for Run-Time Thermal Management Applications
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Topics: Temperature, Thermal management, Algorithms, Computation, Finite element model, Electronic systems, Excitation, Filters, Heat, Impulse (Physics)
Journal Articles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011009.
https://doi.org/10.1115/1.4006137
Published Online: March 21, 2012
View Article titled, Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
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Topics: Heat, Heating, Joules, Temperature, Transients (Dynamics), Transmission lines, Steady state, Resistors, Currents, Simulation
Proceedings Papers

Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects

David Romero, Aydin Nabovati, Gamal Refai-Ahmed, Daniel P. Sellan, Saeed Ghalambor, Niket Shah, Dereje Agonafer, Cristina H. Amon
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 241-249, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52161
https://doi.org/10.1115/IPACK2011-52161
View Paper titled, Enhanced Thermal Map Prediction and Floor Plan Optimization in Electronic Devices Considering Sub-Continuum Thermal Effects
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Topics: Optimization, Temperature effects, Thermal conductivity, Energy generation, Heat transfer, Reliability, Semiconductors (Materials), Simulation, Temperature gradient
Proceedings Papers

Robust Thermal Management for Embedded CPU and GPUs in Displays

Sung Ki Kim, Woo Young Kan, Sang Hak Kim, Vincent Tan, Gamal Refai-Ahmed, Ali Akbar Merrikh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 7-11, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52014
https://doi.org/10.1115/IPACK2011-52014
View Paper titled, Robust Thermal Management for Embedded CPU and GPUs in Displays
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Topics: Graphics processing units, Thermal management, Design, Reliability, Brightness (Photometry), Circuits, Corners (Structural elements), Energy dissipation, Heat, Manufacturing
Proceedings Papers

Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM

Anjali Chauhan, Bahgat Sammakia, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 225-234, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52137
https://doi.org/10.1115/IPACK2011-52137
View Paper titled, Single-Phase Microchannel Cooling for Stacked Single Core Chip and DRAM
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Topics: Cooling, Microchannels, Heat sinks, Thermal management, Thermal resistance, Architecture, Cooling systems, Energy dissipation, Silicon
Proceedings Papers

Single-Phase Liquid Cooling of a Quad-Core Processor

Anjali Chauhan, Bahgat Sammakia, Furat F. Afram, Kanad Ghose, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 235-245, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52139
https://doi.org/10.1115/IPACK2011-52139
View Paper titled, Single-Phase Liquid Cooling of a Quad-Core Processor
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Topics: Cooling, Flow (Dynamics), Microchannels, Energy dissipation, Heat, Temperature, Cooling systems, Design, Engineering standards, Failure
Proceedings Papers

Reduced-Order Fluidic Model for Flow Instabilities in Two-Phase Microfluidic Heat Exchangers

Josef L. Miler, Gamal Refai-Ahmed, Maxat N. Touzelbaev, Milnes P. David, Julie E. Steinbrenner, Kenneth E. Goodson
Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 155-161, August 1–5, 2010
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM-ICNMM2010-30878
https://doi.org/10.1115/FEDSM-ICNMM2010-30878
View Paper titled, Reduced-Order Fluidic Model for Flow Instabilities in Two-Phase Microfluidic Heat Exchangers
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Topics: Flow instability, Heat exchangers, Microfluidics, Bubbles, Flow (Dynamics), Circuits, Modeling, Transients (Dynamics), Boiling, Cooling
Proceedings Papers

Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers

Josef L. Miler, Roger Flynn, Gamal Refai-Ahmed, Maxat Touzelbaev, Milnes David, Julie Steinbrenner, Kenneth E. Goodson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 563-569, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89325
https://doi.org/10.1115/InterPACK2009-89325
View Paper titled, Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers
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Topics: Heat exchangers, Microchannels, Transient heat transfer, Two-phase flow, Heating, Bubbles, Heat sinks, Microfluidics, Nucleation (Physics), Steady state
Proceedings Papers

Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications

Nikhil Lakhkar, Arijit Banerjee, Gamal Refai-Ahmed, Dereje Agonafer
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 571-578, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89341
https://doi.org/10.1115/InterPACK2009-89341
View Paper titled, Multi-Objective Optimization of Graphite Heat Spreader for Portable Systems Applications
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Topics: Flat heat pipes, Graphite, Pareto optimization, Cooling, Copper, Laptop computers, Temperature, Thermal conductivity, Weight (Mass), Density
Proceedings Papers

Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes

Sravan Gondipalli, Bahgat Sammakia, Gamal Refai-Ahmed
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 273-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89076
https://doi.org/10.1115/InterPACK2009-89076
View Paper titled, Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes
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Topics: Heat sinks, Shapes
Proceedings Papers

Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 111-118, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89188
https://doi.org/10.1115/InterPACK2009-89188
View Paper titled, Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance
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Topics: Clocks, Computer simulation, Computers, Control equipment, Junctions, Pareto optimization, Product reliability, Temperature, Temperature gradient
Proceedings Papers

Thermal Characterization of Planar Interconnect Architectures Under Transient Currents

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed
Proc. ASME. IMECE2009, Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C, 1381-1389, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-11996
https://doi.org/10.1115/IMECE2009-11996
View Paper titled, Thermal Characterization of Planar Interconnect Architectures Under Transient Currents
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Topics: Architecture, Currents, Thermal characterization, Transients (Dynamics), Heating, Joules, Finite element analysis, Finite element model, Heat, Microelectronic devices
Journal Articles

Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture

Saket Karajgikar, Dereje Agonafer, Kanad Ghose, Bahgat Sammakia, Cristina Amon, Gamal Refai-Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
https://doi.org/10.1115/1.4001852
Published Online: June 25, 2010
View Article titled, Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
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Topics: Junctions, Temperature, Pareto optimization, Delays, Temperature gradient, Engines