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Proceedings Papers

Heat Transfer and Thermal Pattern in Two-Phase Flow

G. Hetsroni, A. Mosyak, R. Rozenblit, L. P. Yarin

Proc. ASME. IMECE98, Heat Transfer: Volume 5 — Numerical and Experimental Methods in Heat Transfer, 215-220, November 15–20, 1998

Paper No: IMECE1998-0737

DOI: https://doi.org/10.1115/IMECE1998-0737

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Topics: Heat transfer, Two-phase flow, Heat transfer coefficients, Bubbles, Flow (Dynamics), Slug flows, Temperature, Thermography, Visualization, Wall temperature

Proceedings Papers

Subcooled Boiling of Surfactant Solutions

G. Hetsroni, M. Gurevich, A. Mosyak, R. Rozenblit, L. P. Yarin

Proc. ASME. IMECE2001, Heat Transfer: Volume 2 — Heat Transfer in Multiphase Systems, 319-329, November 11–16, 2001

Paper No: IMECE2001/HTD-24183

DOI: https://doi.org/10.1115/IMECE2001/HTD-24183

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Topics: Boiling, Subcooling, Surfactants, Water, Bubbles, Damping, Heat flux, Heat transfer, Heat transfer coefficients, Nucleate boiling

Proceedings Papers

Two-Phase Flow in Microchannels

G. Hetsroni, A. Mosyak, Z. Segal

Proc. ASME. IMECE2001, Heat Transfer: Volume 3 — Fluid-Physics and Heat Transfer for Macro- and Micro-Scale Gas-Liquid and Phase-Change Flows, 87-93, November 11–16, 2001

Paper No: IMECE2001/HTD-24204

DOI: https://doi.org/10.1115/IMECE2001/HTD-24204

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Topics: Microchannels, Two-phase flow, Flow (Dynamics), Heat sinks, Temperature, Boiling, Computer cooling, Fluids, Heat transfer, Imaging

Proceedings Papers

Subcooled Boiling of Surfactant Solutions

G. Hetsroni, M. Gurevich, A. Mosyak, R. Rozenblit, L. P. Yarin

Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 145-152, November 5–10, 2000

Paper No: IMECE2000-1515

DOI: https://doi.org/10.1115/IMECE2000-1515

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Topics: Boiling, Subcooling, Surfactants, Water, Bubbles, Heat transfer coefficients, Frequency response, Heat transfer, Nucleation (Physics), Resolution (Optics)

Proceedings Papers

Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel Microchannels

G. Hetsroni, A. Mosyak, Z. Segal

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 1-9, November 5–10, 2000

Paper No: IMECE2000-2241

DOI: https://doi.org/10.1115/IMECE2000-2241

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Topics: Flow (Dynamics), Microchannels, Temperature distribution

Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni

J. Electron. Packag. June 2014, 136(2): 021003.

Paper No: EP-13-1064

DOI: https://doi.org/10.1115/1.4027325

Published Online: April 29, 2014

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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling

Proceedings Papers

Energy Efficient Two-Phase Micro-Cooler Design for a Concentrated Photovoltaic Triple Junction Cell

A. Reeser, P. Wang, A. Bar-Cohen, G. Hetsroni

Proc. ASME. IMECE2012, Volume 6: Energy, Parts A and B, 1077-1092, November 9–15, 2012

Paper No: IMECE2012-85895

DOI: https://doi.org/10.1115/IMECE2012-85895

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Topics: Design, Junctions, Microcoolers, Cooling, Solar cells, Solar energy, Boiling, Coolers, Critical heat flux, Energy consumption

Journal Articles

Micro-Channels: Reality and Myth

G. Hetsroni, A. Mosyak, E. Pogrebnyak, L. P. Yarin

J. Fluids Eng. December 2011, 133(12): 121202.

DOI: https://doi.org/10.1115/1.4005317

Published Online: December 20, 2011

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Topics: Flow (Dynamics), Microchannels, Pipes, Poiseuille flow, Pressure drop, Surface roughness, Turbulence, Friction, Laminar flow, Reynolds number

Proceedings Papers

Bubble Growth in Surfactant Solutions

G. Hetsroni, A. Mosyak

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 609-617, August 8–13, 2010

Paper No: IHTC14-23091

DOI: https://doi.org/10.1115/IHTC14-23091

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Topics: Bubbles, Surfactants, Water, Boiling, Heat flux, Critical heat flux, Heart failure, Heat transfer, Nucleation (Physics), Atmospheric pressure

Proceedings Papers

Boiling of Water and Surfactants in Confined Space

G. Hetsroni

Proc. ASME. ESDA2008, Volume 4: Fatigue and Fracture; Fluids Engineering; Heat Transfer; Mechatronics; Micro and Nano Technology; Optical Engineering; Robotics; Systems Engineering; Industrial Applications, 185-192, July 7–9, 2008

Paper No: ESDA2008-59216

DOI: https://doi.org/10.1115/ESDA2008-59216