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Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
DOI: https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Paper No: IPACK2015-48670
DOI: https://doi.org/10.1115/IPACK2015-48670
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
DOI: https://doi.org/10.1115/IPACK2015-48592
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

Farzad Houshmand, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A010, July 6–9, 2015
Paper No: IPACK2015-48734
DOI: https://doi.org/10.1115/IPACK2015-48734
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Topics: Boiling, Flow (Dynamics), Heat flux, Methanol, Subcooling, Critical heat flux, Flux (Metallurgy), Pressure drop, Heat, Cooling
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Paper No: IPACK2015-48123
DOI: https://doi.org/10.1115/IPACK2015-48123
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Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Validation Study for VOF Simulations of Boiling in a Microchannel

Catherine Gorlé, Hyoungsoon Lee, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A022, July 6–9, 2015
Paper No: IPACK2015-48129
DOI: https://doi.org/10.1115/IPACK2015-48129
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Topics: Boiling, Microchannels, Simulation, Boundary-value problems, Temperature, Two-phase flow, Flow (Dynamics), Fluids, Heat flux, Heat transfer
Journal Articles

Impact of Flow Dynamics on the Heat Transfer of Bubbly Flow in a Microchannel

Farzad Houshmand, Yoav Peles
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. February 2014, 136(2): 022902.
Paper No: HT-12-1589
DOI: https://doi.org/10.1115/1.4025435
Published Online: November 7, 2013
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Topics: Bubbles, Flow (Dynamics), Heat transfer, Microchannels, Heat transfer coefficients
Proceedings Papers

Heat Transfer Enhancement in Micro-Domains Using Gas-Driven Liquid Film

Farzad Houshmand, Yoav Peles, Michael Amitay
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 705-711, November 9–15, 2012
Paper No: IMECE2012-89121
DOI: https://doi.org/10.1115/IMECE2012-89121
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Topics: Heat transfer, Liquid films, Flow (Dynamics), Gas flow, Microchannels, Heat transfer coefficients, Nitrogen, Pressure drop, Shear (Mechanics), Water