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Emad Samadiani
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021007.
Paper No: EP-14-1041
Published Online: June 1, 2015
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73101
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73196
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A031, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73141
Proceedings Papers
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 997-1006, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-65220
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2012, 134(4): 041401.
Published Online: February 13, 2012
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 807-814, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89187
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031006.
Published Online: September 9, 2010
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
Published Online: May 20, 2010
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2010, 132(7): 071402.
Published Online: April 29, 2010
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 757-764, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33428
Proceedings Papers
Proc. ASME. HT2005, Heat Transfer: Volume 4, 439-451, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: HT2005-72612
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041104.
Published Online: November 13, 2008
Proceedings Papers
Hannah Muchnick, Stephanie C. Thompson, Emad Samadiani, Janet K. Allen, Yogendra Joshi, Farrokh Mistree
Proc. ASME. IDETC-CIE2006, Volume 1: 32nd Design Automation Conference, Parts A and B, 529-543, September 10–13, 2006
Publisher: American Society of Mechanical Engineers
Paper No: DETC2006-99492