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Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar

J. Electron. Packag. June 2017, 139(2): 020902.

Paper No: EP-16-1149

DOI: https://doi.org/10.1115/1.4036356

Published Online: April 24, 2017

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Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives

Proceedings Papers

High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Edvin Cetegen, David McCoy, Pramod Malatkar

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A047, November 11–17, 2016

Paper No: IMECE2016-67007

DOI: https://doi.org/10.1115/IMECE2016-67007

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Topics: Adhesion, Cantilever beams, Electronic packaging, High temperature, Temperature, Adhesives, Testing, Manufacturing, Accelerated life testing, Failure mechanisms

Proceedings Papers

Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink

Paul Kalinowski, Edvin Cetegen, Serguei Dessiatoun, John Lawler

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 741-752, August 8–13, 2010

Paper No: IHTC14-23326

DOI: https://doi.org/10.1115/IHTC14-23326

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Topics: Heat sinks, Computational fluid dynamics, Cooling, Engineering prototypes, Engineering simulation, Heat transfer coefficients, Manifolds, Optimization, Pressure drop, Simulation

Proceedings Papers

Multi Objective Optimization of a Force Fed Microchannel Heat Sink

Edvin Cetegen, Serguei Dessiatoun, Michael Ohadi

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 93-100, December 18–21, 2009

Paper No: MNHMT2009-18150

DOI: https://doi.org/10.1115/MNHMT2009-18150

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Topics: Heat sinks, Microchannels, Pareto optimization, Design, Heat transfer, Optimization, Approximation, Computer simulation, Flow (Dynamics), Genetic algorithms

Proceedings Papers

Heat Transfer Analysis of Force Fed Evaporation on Microgrooved Surfaces

Edvin Cetegen, Serguei Dessiatoun, Michael Ohadi

Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 657-660, June 23–25, 2008

Paper No: ICNMM2008-62285

DOI: https://doi.org/10.1115/ICNMM2008-62285

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Topics: Evaporation, Heat transfer, Heat flux, Pressure, Flux (Metallurgy), Heat, Nucleate boiling, Refrigerants

Proceedings Papers

Studies on Condensation of Refrigerants in a High Aspect Ratio Microchannel and in a Novel Micro-Groove Surface Heat Exchanger: Development of Micro-Condensers in Compact Two Phase Cooling Systems

Serguei Dessiatoun, Sourav Chowdhury, Ebrahim Al-Hajri, Edvin Cetegen, Michael Ohadi

Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 109-116, June 18–20, 2007

Paper No: ICNMM2007-30179

DOI: https://doi.org/10.1115/ICNMM2007-30179

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Topics: Condensation, Condensers (steam plant), Cooling systems, Heat exchangers, Microchannels, Refrigerants, Heat transfer coefficients, Pressure drop, Temperature, Fluids

Proceedings Papers

Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop

Edvin Cetegen, Thomas Baummer, Serguei Dessiatoun, Michael Ohadi

Proc. ASME. IMECE2007, Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B, 1031-1037, November 11–15, 2007

Paper No: IMECE2007-42001

DOI: https://doi.org/10.1115/IMECE2007-42001

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Topics: Condensers (steam plant), Heat flux, Heat transfer, Two-phase flow, Pressure drop, Cooling, Heat, Heat transfer coefficients, Condensation, Electronic components

Journal citation

NARROW

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink

Multi Objective Optimization of a Force Fed Microchannel Heat Sink

Heat Transfer Analysis of Force Fed Evaporation on Microgrooved Surfaces

Studies on Condensation of Refrigerants in a High Aspect Ratio Microchannel and in a Novel Micro-Groove Surface Heat Exchanger: Development of Micro-Condensers in Compact Two Phase Cooling Systems

Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop

Journals

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High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

High Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink

Multi Objective Optimization of a Force Fed Microchannel Heat Sink

Heat Transfer Analysis of Force Fed Evaporation on Microgrooved Surfaces

Studies on Condensation of Refrigerants in a High Aspect Ratio Microchannel and in a Novel Micro-Groove Surface Heat Exchanger: Development of Micro-Condensers in Compact Two Phase Cooling Systems

Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop

Journals

Conference Proceedings

eBooks

Resources

Opportunities

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