1-6 of 6
David T. Read
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Tension-Tension Fatigue of Copper Thin Films

David T. Read
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 175-180, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0732
https://doi.org/10.1115/IMECE1996-0732
View Paper titled, Tension-Tension Fatigue of Copper Thin Films
Open the PDF for Tension-Tension Fatigue of Copper Thin Films in another window
Topics: Copper, Fatigue, Tension, Thin films, Stress, Cycles, Electrons, Fatigue testing, Feedback, Piezoelectric actuators
Journal Articles

Elastic–Plastic Properties of Mesoscale Electrodeposited LIGA Nickel Alloy Films: Analysis of Measurement Uncertainties

Li-Anne Liew, David T. Read, May L. Martin, Peter E. Bradley, John T. Geaney
Journal: Journal of Verification, Validation and Uncertainty Quantification
Publisher: ASME
Article Type: Research-Article
J. Verif. Valid. Uncert. March 2023, 8(1): 011005.
Paper No: VVUQ-22-1022
https://doi.org/10.1115/1.4062106
Published Online: April 6, 2023
View Article titled, Elastic–Plastic Properties of Mesoscale Electrodeposited LIGA Nickel Alloy Films: Analysis of Measurement Uncertainties
Open the PDF for Elastic–Plastic Properties of Mesoscale Electrodeposited LIGA Nickel Alloy Films: Analysis of Measurement Uncertainties in another window
Topics: Measurement uncertainty, Uncertainty, Young's modulus, Yield strength
Proceedings Papers

Microtensile Methodology for Mechanical Characterization of Thin Films

Betty H. Yeung, Bill Lytle, Vijay Sarihan, David T. Read, Yifan Guo
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 69-72, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24708
https://doi.org/10.1115/IMECE2001/EPP-24708
View Paper titled, Microtensile Methodology for Mechanical Characterization of Thin Films
Open the PDF for Microtensile Methodology for Mechanical Characterization of Thin Films in another window
Topics: Thin films, National Institute of Standards and Technology, Materials properties, Materials science, Metallic films, Metals, Optimization, Reliability, Silicon
Proceedings Papers

Comparison of J-Integral Measurement Methods on Clamped Single-Edge Notched Tension Specimens

Timothy S. Weeks, Jeffrey W. Sowards, Ross A. Rentz, David T. Read, Enrico Lucon
Proc. ASME. IPC2016, Volume 3: Operations, Monitoring and Maintenance; Materials and Joining, V003T05A017, September 26–30, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IPC2016-64610
https://doi.org/10.1115/IPC2016-64610
View Paper titled, Comparison of J-Integral Measurement Methods on Clamped Single-Edge Notched Tension Specimens
Open the PDF for Comparison of J-Integral Measurement Methods on Clamped Single-Edge Notched Tension Specimens in another window
Topics: American Petroleum Institute, Base metals, Displacement, Fracture (Materials), Heat, Instrumentation, Metals, Strain gages, Strain gradient, Tension
Journal Articles

Special Section on the Application of Fracture Mechanics in Electronic Packaging

David T. Read
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Preface
J. Electron. Packag. December 1998, 120(4): 321.
https://doi.org/10.1115/1.2792640
Published Online: December 1, 1998
View Article titled, Special Section on the Application of Fracture Mechanics in Electronic Packaging
Open the PDF for Special Section on the Application of Fracture Mechanics in Electronic Packaging in another window
Topics: Electronic packaging, Fracture mechanics
Journal Articles

Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses

David T. Read, James W. Dally
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 1–6.
https://doi.org/10.1115/1.2792062
Published Online: March 1, 1995
View Article titled, Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses
Open the PDF for Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses in another window
Topics: Aluminum, Fatigue, Stress, Thin films, Cycles, Fatigue life, Fracture (Materials), Titanium, Tensile strength