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Darin Sharar
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Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
DOI: https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO)

Peter deBock, Rinaldo Miorini, Cathleen Hoel, Darin Sharar, Bryan Whalen
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
DOI: https://doi.org/10.1115/IPACK2020-2606
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Topics: Electronics, Experimental characterization, Heat transfer, Swirling flow, Thermal energy storage, Transients (Dynamics), Two-phase flow
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
DOI: https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
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Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Proceedings Papers

Experimental Investigation of a Flat-Plate Oscillating Heat Pipe During High-Gravity Loading

Hongbin Ma, Scott M. Thompson, Aaron A. Hathaway, Chris D. Smoot, Corey A. Wilson, Robert M. Young, Lawrence Greenberg, Brian R. Osick, Stephen Van Campen, Brian C. Morgan, Darin Sharar, Nicholas Jankowski
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 627-632, November 11–17, 2011
Paper No: IMECE2011-64821
DOI: https://doi.org/10.1115/IMECE2011-64821
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Topics: Flat plates, Gravity (Force), Heat pipes, Thermal conductivity