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D. Josell
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Journal Articles

Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves

D. Josell, W. E. Wallace, J. A. Warren, D. Wheeler, A. C. Powell, IV
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 227–233.
https://doi.org/10.1115/1.1463732
Published Online: July 26, 2002
View Article titled, Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves
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Topics: Displacement, Flip-chip, Modeling, Shear (Mechanics), Solder joints, Solders, Wetting, Geometry, Copper
Journal Articles

Dynamic Aspects of Wetting Balance Tests

K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 174–183.
https://doi.org/10.1115/1.2792149
Published Online: September 1, 1996
View Article titled, Dynamic Aspects of Wetting Balance Tests
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Topics: Wetting, Plates (structures), Fluids, Glass, Shapes, Solders, Computer software, Equilibrium (Physics), Flow (Dynamics), Shear stress