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Cheng-Hui Lin
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
Published Online: November 9, 2021
Includes: Supplementary data
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031105.
Paper No: EP-19-1137
Published Online: April 17, 2020
Includes: Supplementary data
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Paper No: IPACK2019-6372