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Proceedings Papers

Thermal-Mechanical Coupling Analysis of Board-Level Chip-Scale Packages Subjected to Power Cycling of Different Powering Durations

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Kuo-Yuan Lee
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 241-246, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-41363
https://doi.org/10.1115/IMECE2007-41363
View Paper titled, Thermal-Mechanical Coupling Analysis of Board-Level Chip-Scale Packages Subjected to Power Cycling of Different Powering Durations
Open the PDF for Thermal-Mechanical Coupling Analysis of Board-Level Chip-Scale Packages Subjected to Power Cycling of Different Powering Durations in another window
Topics: Ball-Grid-Array packaging, Computer simulation, Deformation, Fatigue, Reliability, Solder joints, Steady state, Temperature, Thermomechanics, Transients (Dynamics)
Journal Articles

Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Mem. ASME, Kuo-Yuan Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011001.
https://doi.org/10.1115/1.3068294
Published Online: February 11, 2009
View Article titled, Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages
Open the PDF for Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages in another window
Topics: Fatigue, Reliability, Temperature, Transients (Dynamics), Cycles, Solder joints, Ball-Grid-Array packaging, Modeling, Steady state
Journal Articles

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Yu-Cheng Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 281–284.
https://doi.org/10.1115/1.2229229
Published Online: October 7, 2005
View Article titled, Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
Open the PDF for Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions in another window
Topics: Boundary-value problems, Temperature, Thermal analysis, Transients (Dynamics), Vehicles, Finite element analysis, Junctions