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Cemal Basaran, Assoc. Prof., and Director,
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Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 134–138.
DOI: https://doi.org/10.1115/1.1535446
Published Online: March 14, 2003
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Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics
Journal Articles

Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

Cemal Basaran, Assoc. Prof., and Director,, Rumpa Chandaroy, Staff Consultant,
Journal: Journal of Electronic Packaging
Article Type: Papers On Reliability
J. Electron. Packag. March 2002, 124(1): 60–66.
DOI: https://doi.org/10.1115/1.1400752
Published Online: March 15, 2001
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Topics: Constitutive equations, Damage, Fatigue life, Solder joints, Stress, Thermomechanics, Vibration, Finite element analysis, Reliability, Thermal expansion
Journal Articles

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Cemal Basaran, Assoc. Prof. and Director,, Ying Zhao, Senior Reliability Engineer,
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 218–224.
DOI: https://doi.org/10.1115/1.1362674
Published Online: July 6, 1999
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Topics: Adhesives, Damage, Elastic analysis, Finite element analysis, Stress, Stress concentration, Electronic packaging, Shear stress, Stress singularity