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Proceedings Papers

A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys

Cemal Basaran
Proc. ASME. IMECE96, Structural Analysis in Microelectronics and Fiber Optics, 149-153, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0729
https://doi.org/10.1115/IMECE1996-0729
View Paper titled, A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys
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Topics: Alloys, Constitutive equations, Solders, Tin, Deformation, Plasticity, Modeling, Thermomechanics, Viscoplasticity
Proceedings Papers

A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading

Cemal Basaran, Rumpa Chandaroy
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 227-242, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0822
https://doi.org/10.1115/IMECE1997-0822
View Paper titled, A Study on Reliability of Pb40/Sn60 Solder Joints Under Dynamic Loading
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Topics: Dynamic testing (Materials), Reliability, Solder joints, Dynamic analysis, Failure mechanisms, Solders, Constitutive equations, Cycles, Defense industry, Failure
Proceedings Papers

A Viscoplasticity Model for Solder Alloys

Yongchang Lee, Cemal Basaran
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 309-316, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37106
https://doi.org/10.1115/IMECE2010-37106
View Paper titled, A Viscoplasticity Model for Solder Alloys
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Topics: Alloys, Solders, Viscoplasticity, Creep, Stress, Diffusion processes, Dislocation motion, Electronic packaging, Grain size, Reliability
Journal Articles

A Creep Model for Solder Alloys

Yongchang Lee, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044501.
https://doi.org/10.1115/1.4005288
Published Online: November 17, 2011
View Article titled, A Creep Model for Solder Alloys
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Topics: Alloys, Creep, Solders
Journal Articles

Introduction for JEP Special Issue on Carbon Nanotubes

Tarek Ragab, Dr., Cemal Basaran, Dr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
https://doi.org/10.1115/1.4004324
Published Online: July 1, 2011
View Article titled, Introduction for JEP Special Issue on Carbon Nanotubes
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Topics: Carbon nanotubes, Electronic packaging, Chirality, Electron field emission, Nanoelectronics, Strength (Materials)
Journal Articles

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Tarek Ragab, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020903.
https://doi.org/10.1115/1.4003866
Published Online: June 7, 2011
View Article titled, The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations
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Topics: Atoms, Carbon nanotubes, Chain, Displacement, Failure, Molecular dynamics simulation, Nanotubes, Simulation, Single-walled carbon nanotubes, Stress
Proceedings Papers

Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 193-200, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89014
https://doi.org/10.1115/InterPACK2009-89014
View Paper titled, Full Field Joule Heating Measurement of Copper Plate Using Phase Shifting Moire´ Interferometry in Microscopic Scale
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Topics: Copper, Heating, Interferometry, Joules, Heat, Current density, Design, Electrodiffusion, Electronic packaging, Energy dissipation
Proceedings Papers

Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension

Cemal Basaran, Tarek Ragab
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 513-516, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89005
https://doi.org/10.1115/InterPACK2009-89005
View Paper titled, Damage Mechanics of Carbon Nano Tubes Under Uniaxial Tension
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Topics: Carbon, Damage mechanics, Nanotubes, Tension, Stress, Single-walled carbon nanotubes, Boundary-value problems, Computation, Displacement, Molecular dynamics simulation
Proceedings Papers

Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting

Bicheng Chen, Cemal Basaran
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 647-654, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89016
https://doi.org/10.1115/InterPACK2009-89016
View Paper titled, Continuous Wavelet Transform Based Nanoscale Strain Field Measurement Using Moire´ Interferometry With Phase Shifting
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Topics: Interferometry, Nanoscale phenomena, Wavelet transforms, Resolution (Optics), Tensors, Accelerated life testing, Ball-Grid-Array packaging, Computer software, Design, Dynamic testing (Materials)
Proceedings Papers

Electromigration Damage Mechanics of Interconnects

Cemal Basaran, Minghui Lin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 83-94, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89006
https://doi.org/10.1115/InterPACK2009-89006
View Paper titled, Electromigration Damage Mechanics of Interconnects
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Topics: Damage mechanics, Electrodiffusion, Damage, Nanoelectronics, Boundary-value problems, Current density, Diffusion (Physics), Copper, Materials degradation, Plasticity
Journal Articles

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Mohd F. Abdulhamid, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011002.
https://doi.org/10.1115/1.3068296
Published Online: February 11, 2009
View Article titled, Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
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Topics: Annealing, Lead-free solders, Mechanical properties, Solder joints, Solders, Temperature gradient, Tin, Testing, Elastic moduli, Nanoindentation
Proceedings Papers

Mechanical Implications of High Current Densities in Flip Chip Solder Joints

Hua Ye, Cemal Basaran, Douglas Hopkins
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 477-483, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33650
https://doi.org/10.1115/IMECE2002-33650
View Paper titled, Mechanical Implications of High Current Densities in Flip Chip Solder Joints
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Topics: Flip-chip, Flip-chip devices, Solder joints, Electrodiffusion, Temperature, Solders, Anodes, Current density, Damage, Nanoindentation
Proceedings Papers

Irreversible Thermodynamics for Damage Mechanics of Solid Materials

Cemal Basaran, Shihua Nie
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 193-198, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32937
https://doi.org/10.1115/IMECE2002-32937
View Paper titled, Irreversible Thermodynamics for Damage Mechanics of Solid Materials
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Topics: Damage mechanics, Nonequilibrium thermodynamics, Damage, Entropy, Solids
Proceedings Papers

Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading

Cemal Basaran, Hong Tang, Shihua Nie
Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 229-236, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32849
https://doi.org/10.1115/IMECE2002-32849
View Paper titled, Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading
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Topics: Damage mechanics, Fatigue, Solder joints, Damage, Stress, Ball-Grid-Array packaging, Elastic moduli, Fatigue damage, Fatigue life, Materials degradation
Proceedings Papers

Elastic Modulus of Pb/Sn Solder Joints in Microelectronics

Cemal Basaran, Jianbin Jiang
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 141-150, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39632
https://doi.org/10.1115/IMECE2002-39632
View Paper titled, Elastic Modulus of Pb/Sn Solder Joints in Microelectronics
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Topics: Elastic moduli, Microelectronic devices, Solder joints, Tin, Alloys, Solders, Crystals, Deformation, Elasticity, Grain size
Proceedings Papers

Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging

Cemal Basaran, Hong Tang
Proc. ASME. IMECE2002, Applied Mechanics and Biomedical Technology, 61-68, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-32874
https://doi.org/10.1115/IMECE2002-32874
View Paper titled, Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging
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Topics: Damage mechanics, Microelectronic packaging, Solders, Damage, Ball-Grid-Array packaging, Thermomechanics, Alloys, Constitutive equations, Engineering simulation, Fatigue
Proceedings Papers

Length Scale in Solder Joints Materials

Juan Gomez, Cemal Basaran
Proc. ASME. IMECE2006, Applied Mechanics, 1-8, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13206
https://doi.org/10.1115/IMECE2006-13206
View Paper titled, Length Scale in Solder Joints Materials
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Topics: Alloys, Aluminum, Constitutive equations, Copper, Nickel, Plasticity, Solder joints, Solders, Strain gradient, Tin
Proceedings Papers

Thermomigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints

Shidong Li, Minghui Lin, Mohd F. Abdulhamid, Cemal Basaran
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 235-239, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13046
https://doi.org/10.1115/IMECE2006-13046
View Paper titled, Thermomigration Induced Strain Field Simulation for Microelectronic Lead Free Solder Joints
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Topics: Lead-free solders, Simulation, Stress, Electronic equipment, Diffusion (Physics), Displacement, Failure, Finite element analysis, Materials properties, Shock (Mechanics)
Proceedings Papers

Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints

Mohd F. Abdulhamid, Cemal Basaran, Douglas C. Hopkins
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 53-57, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13119
https://doi.org/10.1115/IMECE2006-13119
View Paper titled, Experimental Study of Thermomigration in Lead-Free Nanoelectronics Solder Joints
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Topics: Intermetallic compounds, Nanoelectronics, Solder joints, Solders, Temperature gradient, Tin
Journal Articles

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Juan Gomez, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
https://doi.org/10.1115/1.2721082
Published Online: October 4, 2006
View Article titled, Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys
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Topics: Alloys, Nanoindentation, Plasticity, Solders, Strain gradient, Microelectronic devices