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Journal Articles

Effect of Nonlinear Elastic Behavior on Bilayer Decohesion of Thin Metal Films From Nonmetal Substrates

S. P. Baker, Mem. ASME, X. Wang, C.-Y. Hui
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. July 2002, 69(4): 407–414.
https://doi.org/10.1115/1.1468998
Published Online: June 20, 2002
View Article titled, Effect of Nonlinear Elastic Behavior on Bilayer Decohesion of Thin Metal Films From Nonmetal Substrates
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Topics: Elasticity, Glass, Metals, Stress, Nonmetallic materials, Fracture (Materials), Adhesion
Journal Articles

A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

C. Y. Hui, H. D. Conway, Y. Y. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 267–273.
https://doi.org/10.1115/1.1287930
Published Online: September 1, 2000
View Article titled, A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate
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Topics: Stress, Thin films, Fracture (Materials), Composite materials, Residual stresses, Deformation
Journal Articles

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

J. Jiao, C. K. Gurumurthy, E. J. Kramer, Y. Sha, C. Y. Hui, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 349–353.
https://doi.org/10.1115/1.2792645
Published Online: December 1, 1998
View Article titled, Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses
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Topics: Cantilever beams, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Thermal stresses
Journal Articles

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris, C.-Y. Hui, E. J. Kramer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 372–378.
https://doi.org/10.1115/1.2792649
Published Online: December 1, 1998
View Article titled, A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces
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Topics: Fatigue testing, Polymers, Thermomechanics, Fracture (Materials), Displacement, Cycles, Fatigue, Cantilever beams, Delamination, Failure
Journal Articles

Asymptotic Stress Field of a Mode III Crack Growing Along an Elastic/Elastic Power-Law Creeping Bimaterial Interface

C.-Y. Hui, M. T. A. Saif
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. June 1994, 61(2): 384–389.
https://doi.org/10.1115/1.2901455
Published Online: June 1, 1994
View Article titled, Asymptotic Stress Field of a Mode III Crack Growing Along an Elastic/Elastic Power-Law Creeping Bimaterial Interface
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Topics: Fracture (Materials), Stress, Materials properties, Shear (Mechanics)
Journal Articles

Evaluation of a Complex Stress Intensity Factor of Interface Cracks: A Perturbation Approach

C. Y. Hui, Y. C. Chen
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. March 1993, 60(1): 221–222.
https://doi.org/10.1115/1.2900755
Published Online: March 1, 1993
View Article titled, Evaluation of a Complex Stress Intensity Factor of Interface Cracks: A Perturbation Approach
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Topics: Fracture (Materials), Stress
Journal Articles

The Effective Thermal Conductivity of a Packing of Spheres

A. Jagota, C. Y. Hui
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Briefs
J. Appl. Mech. September 1990, 57(3): 789–791.
https://doi.org/10.1115/1.2897096
Published Online: September 1, 1990
View Article titled, The Effective Thermal Conductivity of a Packing of Spheres
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Topics: Packing (Shipments), Packings (Cushioning), Thermal conductivity, Anisotropy, Granular materials, Temperature, Tensors, Textiles
Journal Articles

Chemically Driven Deformation of Polymers

C.-Y. Hui, K.-C. Wu, Ronald C. Lasky, Edward J. Kramer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 68–73.
https://doi.org/10.1115/1.3226511
Published Online: March 1, 1989
View Article titled, Chemically Driven Deformation of Polymers
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Topics: Deformation, Polymers, Diffusion (Physics), Glass, Pressure, Electronic packaging, Photoresists, Polymer chains, Printed circuit boards
eBook Chapter

Growth of Macroscopic Cracks by Void Coalescence Under Extensive Creeping Conditions

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1988
https://doi.org/10.1520/STP26772S
ISBN-10: 0-8031-1174-6
ISBN: 978-0-8031-1174-5
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Journal Articles

A Complex-Variable Method for Two-Dimensional Internal Stress Problems and Its Applications to Crack Growth in Nonelastic Materials: Part II—Applications

K. C. Wu, C. Y. Hui
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 1987, 54(1): 65–71.
https://doi.org/10.1115/1.3172996
Published Online: March 1, 1987
View Article titled, A Complex-Variable Method for Two-Dimensional Internal Stress Problems and Its Applications to Crack Growth in Nonelastic Materials: Part II—Applications
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Topics: Fracture (Materials), Stress, Integral equations, Steady state, Wakes, Deformation, Plane strain, Shear (Mechanics), Structural mechanics, Temperature distribution
Journal Articles

A Complex-Variable Method for Two-Dimensional Internal Stress Problems and Its Applications to Crack Growth in Nonelastic Materials: Part I—Theory

K. C. Wu, C. Y. Hui
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. March 1987, 54(1): 59–64.
https://doi.org/10.1115/1.3172995
Published Online: March 1, 1987
View Article titled, A Complex-Variable Method for Two-Dimensional Internal Stress Problems and Its Applications to Crack Growth in Nonelastic Materials: Part I—Theory
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Topics: Fracture (Materials), Stress
Journal Articles

Eddy Current Flow Near Cracks in Thin Plates

C. Y. Hui, A. Ruina
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. December 1985, 52(4): 841–846.
https://doi.org/10.1115/1.3169156
Published Online: December 1, 1985
View Article titled, Eddy Current Flow Near Cracks in Thin Plates
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Topics: Eddies (Fluid dynamics), Eddy currents (Electricity), Flow (Dynamics), Fracture (Materials), Plates (structures), Magnetic fields, Current density, Fracture mechanics, Heat conduction