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Bernhard Wunderle
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
Published Online: June 17, 2019
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 27–30, 2018
Paper No: IPACK2018-8348
Journal Articles
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
Published Online: October 21, 2016
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A007, July 16–18, 2013
Paper No: IPACK2013-73317