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Bernhard Wunderle
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Journal Articles

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
DOI: https://doi.org/10.1115/1.4043646
Published Online: June 17, 2019
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Topics: Cycles, Failure, Junctions, Temperature, Wire, Stress, Failure mechanisms, Thermomechanics
Proceedings Papers

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices for Automotive Applications

Alexander Otto, Sven Rzepka, Bernhard Wunderle
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 27–30, 2018
Paper No: IPACK2018-8348
DOI: https://doi.org/10.1115/IPACK2018-8348
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Topics: Automotive industry, Cycles, Electronics, Stress, Reliability, Heating, Testing, Failure, Failure mechanisms, Junctions
Journal Articles

Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal: Journal of Electronic Packaging
Article Type: Errata
J. Electron. Packag. March 2017, 139(1): 017001.
Paper No: EP-16-1133
DOI: https://doi.org/10.1115/1.4035707
Published Online: January 19, 2017
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Topics: Electrons, Packaging
Journal Articles

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
DOI: https://doi.org/10.1115/1.4034927
Published Online: October 21, 2016
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Topics: Fillers (Materials), Particulate matter, Cavities, Nanoparticles
Proceedings Papers

Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

Maaike M. V. Taklo, Astrid-Sofie Vardøy, Ingrid De Wolf, Veerle Simons, H. J. van de Wiel, Adri van der Waal, Adriana Lapadatu, Stian Martinsen, Bernhard Wunderle
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A007, July 16–18, 2013
Paper No: IPACK2013-73317
DOI: https://doi.org/10.1115/IPACK2013-73317
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Topics: Packaging, Semiconductor wafers, Silicon, Stress, Tin, Vehicles, Bonding, Modeling, Transistors, Bolometers