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Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018

Paper No: IPACK2018-8311

DOI: https://doi.org/10.1115/IPACK2018-8311

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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields

Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz

J. Electron. Packag. June 2016, 138(2): 021004.

Paper No: EP-16-1035

DOI: https://doi.org/10.1115/1.4033109

Published Online: April 19, 2016

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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation

Proceedings Papers

An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

Hafiz M. Hashim, Baris Dogruoz, Mehmet Arik, Murat Parlak

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015

Paper No: IPACK2015-48024

DOI: https://doi.org/10.1115/IPACK2015-48024

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Topics: Axial flow, Computational fluid dynamics, Performance characterization, Flow (Dynamics), Engineering simulation, Engineers, Fans, Pressure, Pressure drop, Simulation

Proceedings Papers

A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Muhammad Ikhlaq, Baris Dogruoz, Omidreza Ghaffari, Mehmet Arik

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015

Paper No: IPACK2015-48094

DOI: https://doi.org/10.1115/IPACK2015-48094

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Topics: Heat transfer, Momentum, Nozzles, Boundary-value problems, Flow (Dynamics), Temperature, Computational fluid dynamics, Cooling, Diaphragms (Mechanical devices), Diaphragms (Structural)

Proceedings Papers

Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

Enes Tamdogan, Mehmet Arik, M. Baris Dogruoz

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013

Paper No: IPACK2013-73031

DOI: https://doi.org/10.1115/IPACK2013-73031

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Topics: Cooling, Design, Light-emitting diodes

Proceedings Papers

A Numerical Study of a Single Unsteady Laminar Slot Jet in a Confined Structure

Omidreza Ghaffari, M. Baris Dogruoz, Mehmet Arik

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T23A008, July 14–19, 2013

Paper No: HT2013-17833

DOI: https://doi.org/10.1115/HT2013-17833

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Topics: Cooling, Electronics, Flow (Dynamics), Heat transfer, Jets, Nozzles, Pressure, Transients (Dynamics)

Proceedings Papers

Advances in Fan Modeling: Issues and Effects on Thermal Design of Electronics

M. Baris Dogruoz, Gokul Shankaran

Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 1515-1522, November 9–15, 2012

Paper No: IMECE2012-89857

DOI: https://doi.org/10.1115/IMECE2012-89857

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Topics: Design, Electronics, Modeling, Fans, Flow (Dynamics), Impellers, Axial flow, Computation, Cooling, Electronic systems

Proceedings Papers

Computational Modeling of Anisotropic Thermal Conductivity and Joule Heating on Printed Circuit Boards

M. Baris Dogruoz, Gokul Shankaran, Gregory Pitner, Manoj Nagulapally

Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1381-1388, November 11–17, 2011

Paper No: IMECE2011-65626

DOI: https://doi.org/10.1115/IMECE2011-65626

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Topics: Anisotropy, Computer simulation, Heating, Joules, Printed circuit boards, Thermal conductivity, Electric fields, Temperature, Dielectric materials, Engineering simulation

Proceedings Papers

Accurate Prediction of Transient Thermal Behavior of Electronic Systems With State-Space Models

M. Baris Dogruoz, Ryan Magargle, Gokul Shankaran

Proc. ASME. IMECE2011, Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B, 1389-1395, November 11–17, 2011

Paper No: IMECE2011-65628

DOI: https://doi.org/10.1115/IMECE2011-65628

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Topics: Electronic systems, Transients (Dynamics), Computational fluid dynamics, Steady state, Engineering simulation, Simulation, Capacitors, Computation, Curve fitting, Energy dissipation

Proceedings Papers

Advances in Fan Modeling: Using Multiple Reference Frame (MRF) Approach on Blowers

Gokul Shankaran, M. Baris Dogruoz

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 259-267, July 6–8, 2011

Paper No: IPACK2011-52172

DOI: https://doi.org/10.1115/IPACK2011-52172

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Topics: Impellers, Modeling

Journal Articles

Effects of Trace Layers and Joule Heating on the Temperature Distribution of Printed Circuit Boards: A Computational Study

M. Baris Dogruoz, Manoj K. Nagulapally

J. Thermal Sci. Eng. Appl. June 2009, 1(2): 022003.

DOI: https://doi.org/10.1115/1.4000286

Published Online: November 12, 2009

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Topics: Heating, Joules, Printed circuit boards, Temperature, Thermal conductivity, Computational fluid dynamics, Geometry, Electrical conductivity, Heat transfer

Proceedings Papers

Experiments and Modeling of the Heat Transfer of In-Line Square Pin Fin Heat Sinks With Top By-Pass Flow

M. Baris Dogruoz, Mario Urdaneta, Alfonso Ortega

Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 195-206, November 17–22, 2002

Paper No: IMECE2002-39245

DOI: https://doi.org/10.1115/IMECE2002-39245

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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Modeling

Proceedings Papers

A Numerical Study of Turbulent Heat Transfer in Unconfined Impinging Slot Jets

M. Baris Dogruoz, Alfonso Orgega

Proc. ASME. IMECE2003, Heat Transfer, Volume 4, 397-404, November 15–21, 2003

Paper No: IMECE2003-43347

DOI: https://doi.org/10.1115/IMECE2003-43347

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Topics: Jets, Turbulence, Turbulent heat transfer, Nozzles, Computation, Boundary-value problems, Flat plates, Flow simulation, Reynolds number, Shapes

Journal Articles

A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

M. Baris Dogruoz, Alfonso Ortega, Russell V. Westphal

J. Electron. Packag. March 2006, 128(1): 53–60.

DOI: https://doi.org/10.1115/1.2159009

Published Online: July 30, 2005

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Topics: Flow (Dynamics), Heat sinks, Leakage, Heat transfer, Pressure drop

Journal citation

NARROW

Discrete Phase Analysis of Self Heating Particles Over an Immersion Liquid Cooled High Power Blue Light-Emitting Diode With Suspended Phosphor Particles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Direct Liquid Cooling of High Flux LED Systems: Hot Spot Abatement

A Numerical Study of a Single Unsteady Laminar Slot Jet in a Confined Structure

Advances in Fan Modeling: Issues and Effects on Thermal Design of Electronics

Computational Modeling of Anisotropic Thermal Conductivity and Joule Heating on Printed Circuit Boards

Accurate Prediction of Transient Thermal Behavior of Electronic Systems With State-Space Models

Advances in Fan Modeling: Using Multiple Reference Frame (MRF) Approach on Blowers

Effects of Trace Layers and Joule Heating on the Temperature Distribution of Printed Circuit Boards: A Computational Study

Experiments and Modeling of the Heat Transfer of In-Line Square Pin Fin Heat Sinks With Top By-Pass Flow

A Numerical Study of Turbulent Heat Transfer in Unconfined Impinging Slot Jets

A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

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