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Ashkan Akbariyeh
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Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
DOI: https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Application of the Semi-Analytic Complex Variable Method to Computing Sensitivities in Heat Conduction

James Grisham, Ashkan Akbariyeh, Weiya Jin, Brian H. Dennis, Bo P. Wang
Journal: Journal of Heat Transfer
Article Type: Research-Article
J. Heat Transfer. August 2018, 140(8): 082006.
Paper No: HT-17-1109
DOI: https://doi.org/10.1115/1.4039541
Published Online: June 29, 2018
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Topics: Finite element analysis, Heat conduction, Steady state, Event history analysis, Errors, Finite difference methods, Finite element methods, Stiffness, Computation, Algorithms
Proceedings Papers

Inverse Determination of Moving Heat Flux Distributions Using Reduced Order Models

Brian H. Dennis, Ashkan Akbariyeh, John Michopoulos, Foteini Komninelli, Athanasios Iliopoulos
Proc. ASME. IDETC-CIE2014, Volume 1A: 34th Computers and Information in Engineering Conference, V01AT02A026, August 17–20, 2014
Paper No: DETC2014-35274
DOI: https://doi.org/10.1115/DETC2014-35274
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Topics: Heat flux, Finite element model, Optimization, Temperature, Inverse problems, Differential equations, Galerkin method, Heat transfer, Optimization algorithms, Parameter estimation
Proceedings Papers

Performance of Reduced Order Models of Moving Heat Source Deposition Problems for Efficient Inverse Analysis

John G. Michopoulos, Brian Dennis, Foteini Komninelli, Athanasios Iliopoulos, Ashkan Akbariyeh
Proc. ASME. IDETC-CIE2014, Volume 1A: 34th Computers and Information in Engineering Conference, V01AT02A027, August 17–20, 2014
Paper No: DETC2014-35365
DOI: https://doi.org/10.1115/DETC2014-35365
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Topics: Heat, Finite element analysis, Heat transfer, Performance characterization, Principal component analysis, Sensitivity analysis