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Alec Nordlund
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Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Paper No: IPACK2021-74108
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041101.
Paper No: EP-21-1034
Published Online: August 9, 2021